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September 29, 2006

Nokia and Intel Bring FMC to Notebooks

By Erik Linask, Associate Editor,
Internet Telephony magazine

With FMC (fixed/mobile convergence) becoming a reality in the world of mobile phones — several phone manufacturers and carriers have already introduced dual mode handsets — the next logical question is, when will that technology be adapted for mobile computing. The answer may come sooner than many expect, as Nokia (News - Alert) and Intel (News - Alert) Corporation are teaming to make FMC a reality for laptop computer owners.

Nokia is expanding into the HSDPA realm, looking to give notebook computers the power of embedded wireless wide area networking (WWAN). The HSDPA connectivity module that Nokia has developed will be incorporated into laptops as part of Intel’s Centrino Duo mobile platform. Designed with the mobile user in mind, Centrino Duo includes technology to extend battery life, maximize performance, and, in general, enable users to make the most of their wireless options. The cellular connectivity module will become an available embedded option.
The combination of HSDPA cellular with other wireless technologies in notebook computers will magnify the power of users to choose the best radio connection, as well as create a seamless connectivity situation through various wireless network connections. 
This collaboration unites two of the world’s preeminent players in the mobile technology space. Nokia has long been a leader in advancing wireless technology, and with this development, will position itself well in the mobile computing market — Intel, does, after all, still own a majority of the chip market. For Intel, this could also be a way to reverse the trend and retake some of what it has lost to AMD.
“This collaboration is good news for notebook users, as cellular technology offers superior connectivity and mobility for notebook and other portable device users.  This is also a natural area for Nokia’s multiradio expertise to expand,” said Heikki Tenhunen, head of Nokia’s Connectivity Module Business Program.”
Nokia’s connectivity module will complement Intel’s wireless technologies, uniting top of the line computing with next generation wireless technologies. Intel will handle platform design, software, integration, and support, as well as sales and marketing; Nokia brings to the table its HSDPA knowledge, connectivity expertise, and extensive carrier relationships — which will all be required to successfully implement FMC for notebooks. Nokia will also manufacture the module itself.
“This module complements Intel’s WiFi (News - Alert) and WiMAX solutions to offer expanded connectivity options for notebook users,” said Mooly Eden, vice president and general manager of Intel’s Mobile Platforms Group.
In addition to expanding the wireless world for notebooks immeasurably, HSDPA integration will also enable higher data transfer speeds, up to 14.4 Mbps on the downlink and 2 Mbps on the uplink.
Come learn about 3G, WiFi, WiMAX, and other technologies at INTERNET TELEPHONY Conference & EXPO, being held in San Diego from October 10-13. At ITEXPO, you will have the opportunity to meet with more than 150 vendors contributing to the growth of the IP Communications space, including the wireless arena, as well as attend conference sessions and keynotes presented by many of the most respected members of this community. Don’t miss this opportunity to be part of the biggest global IP Communications event of the year!
Erik Linask is Associate Editor of INTERNET TELEPHONY. Most recently, he was Managing Editor at Global Custodian, an international securities services publication. To see more of his articles, please visit Erik Linask’s columnist page.


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