[May 29, 2015] |
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ASE to Showcase System-in-Package Applications at Computex 2015
Advanced Semiconductor (News - Alert) Engineering, Inc (TAIEX:2311, NYSE:ASX), the
world's largest semiconductor assembly and test service provider, today
announced it will be showcasing System in Package (SiP) solutions in
consumer applications at Computex 2015, scheduled to take place in
Taipei, Taiwan, over June 2-5, 2015. These SiP applications highlight
the synergy between ASE's IC packaging, material and test technologies,
together with the strong expertise of Universal Scientific Industrial
Shanghai Co, Ltd (USI; SHA: 601231) in module level manufacturing
services to bring SiP into the realm of the Internet-of-Things (IoT).
SiP technology enables multiple semiconductor chips and passive
components to be integrated within a smaller and more compact module
without compromising the functionality and performance of the entire
package or module. Hence, SiP can be ideally applied to many of today's
consumer technologies that require heterogeneous integration of numerous
IC functions such as RF, processor, memory, sensors, power management,
multimedia, and more, within very tight space constraints.
ASE's developments in SiP also serve to protect the environment as it
reduces the number of required manufacturing steps. Previously, each
device function was developed onto individual IC chips, but with SiP
technology, the ICs can be designed and directly embedded onto a
substrate, then onto a module. The reduction in manufacturing steps
results in less required materials as well as increased efficiency in
logistics management during inventory shipment.
To better serve the fast-growing IoT segment, ASE has evolved its
business model by combining its technologies in wire bonding, wafer
level, fan-out, flip chip, 2.5D/3D, substrates and embedded IC packaging
with USI's module level assembly to establish a strong leadership in
SiP. ASE has alo created a cohesive ecosystem for its SiP platform that
included a key announcement with Inotera Memories Inc (April 7, 2014) on
foundry service for 2.5D silicon interposer and TDK Corporation (May 8,
2015) for proprietary embedded substrate manufacturing. The
collaboration within the supply chain has led to the development of a
world class manufacturing technology that can be used in embedded
solutions within smartphones, wearables, homes, connectivity and sensor
applications.
Computex attendees will find the end result of this collaboration on
display in the ASE VIP suite which is located on the second floor of the
Taipei International Convention Center, number T203A. The exhibits on
display will include mesh lighting (smart lighting) that can be
controlled through an iPad, environmental sensors, Beacon (micro
location) technology, wearables, connectivity and embedded substrate
technology. Attendees will have the opportunity to see how SiP solutions
are implemented into a variety of applications, including smart living,
connectivity, data management and diagnostic devices in healthcare.
About ASE Group
Advanced Semiconductor Engineering, Inc. (ASE Group) is the world's
largest provider of independent semiconductor manufacturing services in
assembly, test, materials and design manufacturing. As a global leader
geared toward meeting the industry's ever-growing needs for faster,
smaller and higher performance chips, ASE develops and offers a wide
portfolio of technology and solutions including IC test program design,
front-end engineering test, wafer probe, wafer bump, substrate design
and supply, wafer level package, flip chip, SiP, final test and
electronic manufacturing services through Universal Scientific
Industrial Co., Ltd. and its subsidiaries, members of ASE Group. ASE
generated sales revenues of US $8.5 billion in 2014 and employs over
68,000 people worldwide. For more information about ASE Group, visit www.aseglobal.com.
About Universal Scientific Industrial
(Shanghai) Co., Ltd.
Universal Scientific Industrial (Shanghai) Co., Ltd. is a global ODM/EMS
company providing design, miniaturization, material sourcing,
manufacturing, logistics, and after services of electronic
devices/modules for brand owners. As a member of ASE Group, USI SH was
founded in 2003 and listed in the Shanghai Stock Exchange in 2012. With
diversified and balanced offerings, plus sales service network in North
America, Europe, Japan, China, Taiwan, as well as manufacturing sites in
China, Taiwan and Mexico, USI serves customers in the sectors of
wireless communication, computer and storage, consumer, industrial, and
automotive electronics worldwide. Visit USI web at www.usish.com.
View source version on businesswire.com: http://www.businesswire.com/news/home/20150529005166/en/
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