[May 24, 2018] |
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Global Substrate-like PCB Market - Need for Miniaturization Drives Growth | Technavio
Technavio's latest market research report on the global
substrate-like PCB market provides an analysis of the most
important trends expected to impact the market outlook from 2018-2022. Technavio
predicts an emerging trend as a major factor that has the potential to
significantly impact the market and contribute to its growth or decline.
This press release features multimedia. View the full release here:
https://www.businesswire.com/news/home/20180524006270/en/
Technavio has published a new market research report on the global substrate-like PCB market from 2018-2022. (Graphic: Business Wire)
The global
substrate-like PCB market will grow at a CAGR of over 7%
during the forecast period, according to Technavio analysts. A key
factor driving the market's growth is the need for miniaturization and
more efficient interconnect solutions. In the recent years, the size of
electronic packages has decreased to reduce power consumption and
increase the functionality and the number of embedded components. The
size of mobile phone PCBs decreased by over 75% between 2004 and 2017,
with the inclusion of a growing number of sensors and processors.
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In this report, Technavio highlights the increasing outsourcing of
activities in the semiconductor industry as one of the key emerging
trends in the global substrate-like
PCB market:
Increasing outsourcing of activities in the
semiconductor industry
Previously, the semiconductor industry was characterized by the presence
of companies that designed, fabricated, packaged, and tested ICs
in-house. But, at present, most semiconductor companies are going
fabless by only designing chips while outsourcing fabrication,
packaging, and testing to other companies. An increasing number of
semiconductor and electronics manufacturing companies are outsourcing
their manufacturing processes to foundries and (semiconductor and
testing services) SATS providers.
"Semiconductor vendors that do not own fabrication facilities
outsource the expensive process of semiconductor manufacturing to
dedicated third-party manufacturers that have large-scale manufacturing
plants, thereby cutting down on capital investments, operational costs,
and complexity," says a senior analyst at Technavio for research on semiconductor
equipment.
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Global substrate-like PCB market segmentation
This market research report segments the global substrate-like
PCB market into the following applications (communication and
IoT) and key regions (the Americas, APAC, and EMEA).
The communication segment held the largest market share in 2017,
accounting for more than 73% of the market. This application segment is
expected to demonstrate steady growth during the forecast period.
APAC was the leading region for the global substrate-like PCB market in
2017, accounting for a market share of approximately 85%. The market
share of this region is anticipated to increase significantly during the
period 2018-2022.
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View source version on businesswire.com: https://www.businesswire.com/news/home/20180524006270/en/
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