[September 01, 2015] |
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Research and Markets: Global High-Density Packaging (MCM, MCP, SIP, 3D-TSV): Market Analysis and Technology Trends 2015
Research and Markets (http://www.researchandmarkets.com/research/b6h7hj/highdensity)
has announced the addition of the "High-Density
Packaging (MCM, MCP, SIP, 3D-TSV): Market Analysis and Technology Trends"
report to their offering.
The explosion of applications in the consumer and mobile space, internet
of things (IoT) and the slowdown of Moore's law have been driving many
new trends and innovations in packaging. The semiconductor industry now
has to focus on system scaling and integration to meet the
ever-increasing electronic system demands for performance and
functionality, and for reduction of system form factor, system power
consumption and system cost.
This paradigm shift from chip-scaling to system-scaling will re-invent
microelectronics, continue driving system bandwidth and performance, and
help sustain Moore's Law. The challenge for semiconductor industry is to
develop a disruptive packaging technology platform capable of achieving
these goals.
This report discusses the packaging trends for higher performance and
density drivng advanced packaging technology solutions for mobile and
IoT applications. One of the key enabling technologies to achieve these
goals is thin 3D-packaging with integration. Developments have lately
been made with various embedding technologies, such as eWLB/Fan out WLP
and embedded devices.
Higher integration levels and lower profiles are also achieved with
wafer-level processes, at which most R&D is concentrated in the
commercialization of 2.5D IC´s (with silicon interposer) & 3D ICs, as
well as coreless substrate. Furthermore, there is tremendous pressure to
decrease overall package height even with the additional dies stacking
through innovation in wafer thinning, TSV, and ultrathin interconnects.
Key Topics Covered:
Chapter 1 Introduction
Chapter 2 Executive Summary
Chapter 3 Technology Issues and Trends
Chapter 4 Applications
Chapter 5 Competitive Environment
Chapter 6 3-D-TSV Technology
Chapter 7 Market Forecast
Companies Mentioned - 30 of the 100+ Companies Featured
- ALLVIA
- Appian Technology
- BeSang
- Elpaq
- Elpida
- Elpida Memory
- Eureka
- Freescale (News - Alert)
- Fujikura
- Fujitsu
- Intersil
- Jazz Semiconductor
- Kodak
- Kyocera
- Lexmark International (News - Alert)
- Lucent Technologies
- MicroModule Systems
- Micron
- Micron Technology
- Mitsubishi
- Motorola
- NEC (News - Alert)
- NXP
- NXP Semiconductors
- STMicroelectronics
- Samsung
- TSMC
- Tektronix (News - Alert)
- Teledyne Electronic Technologies
- Tessera
For more information visit http://www.researchandmarkets.com/research/b6h7hj/highdensity
View source version on businesswire.com: http://www.businesswire.com/news/home/20150901006355/en/
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