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February 13, 2006
NTT DoCoMo, Inc. and Others to Develop New W-CDMA Platform
Several wireless telephony manufacturers and service providers today announced plans to jointly develop a new 3G mobile phone platform.
The companies—NTT DoCoMo, Inc.; Renesas Technology Corp.; Fujitsu Limited; Mitsubishi Electric Corporation; and Sharp Corporation—hope that the new platform will help accelerate adoption of W-CDMA handsets and services.
Designed to serve as a base system for W-CDMA handsets, the new platform will eliminate the need for mobile phone manufacturers to each develop separate systems for common functions. That should reduce the time and cost of handset development, translating into savings for consumers.
The platform will include a single-chip LSI for dual-mode handsets, support for High Speed Downlink Packet Access (HSDPA) and EDGE technologies, and development support including OS, middleware and drivers.
The platform is expected to hit the marketplace late summer 2007, and will debut in Japan on DoMoCo’s FOMA handset and service.
About the Companies
NTT DoCoMo, Inc. is a mobile communications service provider. For more information, visit www.nttdocomo.com.
Renesas Technology Corp. is a manufacturer of semiconductors for the mobile, automotive, and PC/AV markets. For more information, visit http://www.renesas.com.
Fujitsu Limited is a provider of IT and communications solutions. For more information, visit www.fujitsu.com.
Mitsubishi Electric Corporation is a manufacturer of electrical and electronic equipment used in a variety of industries including communications, consumer electronics, and transportation. For more information, visit global.mitsubishielectric.com.
Sharp Corporation is a developer of products and core technologies—including LCDs—for the electronics industry. For more information, visit sharp-world.com.
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Mae Kowalke previously wrote for Cleveland Magazine in Ohio and The Burlington Free Press in Vermont. To see more of her articles, please visit Mae Kowalke’s columnist page.
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