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May 29, 2008

Ralink Intros New WiFi System-on-Chip Solution

By Jayashree Adkoli, TMCnet Contributing Editor

Taiwan-based Ralink (News - Alert) Technology Corporation announced the launch of its new 802.11n single chip AP (Access Point)/routers SoC (System on Chip), RT3052and RT3050. The SoC integrates five-port 10/100 Ethernet Switch and PHY.



 
Ralink Technology Corporation is developer of wireless LAN chipset solutions. The company’s 802.11x chips feature high throughput, extended range, low-power consumption and consistent reliability. These chips are in demanded by WiFi, mobile and embedded applications. 
 
Ralink’s feature-rich chipsets have a high level of chip integration for client and AP solutions for CB, miniPCI, PCI, PCIe and USB interfaces that facilitate customers to develop smaller and more sophisticated mobile wireless products economically.
 
Ralink’s new RT3052 and RT3050 are said to be comprehensive SoC solutions with a high level of integration. This facilitates 802.11n AP/router manufacturers to accelerate time-to-market and also reduce development costs.
 
Ralink’s both the SoC solutions: RT3052 and RT3050 are built on powerful MIPS24KEc processor that enables them to process advanced applications such as Broadband routing, Ethernet to WiFi (News - Alert) bridges, VoIP, Online gaming and Home Entertainment. 
 
Ralink’s RT3052 is an 802.11 b/g/n, 2T2R single chip with USB OTG, RGMII, SPI, PCM, I2C and UART interfaces and RT3050 is an 802.11 b/g/n, 1T1R (1 Transmit 1 Receive) single chip with USB interface.
 
The chipset RT3052 2T2R architecture can deliver data rates of 300 Mbps and also maintains wireless connections over a larger coverage area when compared with other 802.11n solutions.
 
Ralink’s RT3050 1T1R architecture is said to be an ideal choice for manufactures who want to adopt 802.11n against 802.11g AP/routers.
 
“Market is demanding smaller form factor and lower BOM cost for the router devices. Increasing the integration level is the only way to meet the requirement.” said Frank Lu, IC design manager at Ralink Technology, in the statement.
 
 Lu added: “We are proud to overcome the challenges of heat dissipation and interference among various analog blocks when integrating multiple RF transceivers and Ethernet PHY in the same die.”
 
Both the SoC Solution that is packaged in a 14mmx14mm TFBGA-289, features embedded 2.4G CMOS Radio and MAC/BBP with MLD (Maximum Likelihood Decoding) - for optimal decoding performance. These incorporate RDG (Reverse Direction Grant) and Compressed Block ACK for more large quantity data packet transmission with the physical data rate of 300 Mbps. Both the chipset have up to 256 clients with 20 and 40 MHz channel width. They also feature multiple BSSID (Basic Service Set Identifiers) up to 8, WEP (Wired Equivalent Privacy) 64/128, WPA (WiFi Protected Access), WPA2 for security and WPS (WiFi Protected Setup) for ease of use.
 
Both the chipset are 802.11d+h International Regulatory Compliant with hardware frame aggregation and features memory of 16/32-bit SDR SDRAM up to 64 Mbytes. Both have embedded a 7-port Ethernet Switch and a 5-port 10/100, 5 10/100 UTP ports and 1 RGMII/MII port (RT3052). They incorporate hardware NAT, QoS, TCP/UDP (News - Alert)/IP checksum offloading and also shows off WMM (WiFi multimedia), WMM-PS (Power Save).
 
RT3052 and RT3050 802.11n AP SoC reference design kit includes complete turnkey mobile Wi-Fi solutions and software driver that support for the Microsoft (News - Alert)® Windows® Vista and Linux 2.6.
 
Ralink’s patented MIMObility technology enhances Wi-Fi applications compared to traditional PC networking to a range of digital multimedia and handheld devices such as cell phones, PDAs, cameras, print servers, HDTV and video game players. 
 
Jayashree Adkoli is a contributing editor for TMCnet. To read more of Jayashree’s articles, please visit her columnist page.
 

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