JMD's patented process (MLO technology) delivers the industry's smallest high-performance modules for emerging wireless and broadband applications.
MLO technology uses organic materials in a system-on-package (SoP) approach to produce RF modules with higher component aerial density.
"MCT's ability to implement the MLO process has been instrumental in enabling JMD's family of small, highly integrated RF front-end modules for next-generation WLAN and WiMAX
applications. We have been working with MCT for the past year to implement MLO production on a commercial scale," stated Jim Stratigos, President, and CEO of JMD, in a press release.
Roslan Affandi, Senior Vice President of the Substrates and System Packaging Division of AEM Holdings Ltd, MCT's parent company, said: "We are pleased to have been chosen by JMD to manufacture advanced substrates for products based on MLO technology.”
It seems there is a huge potential for MLO technology in the current market with device makers striving to compress more functionality into smaller spaces.
More than anything else, RF modules produced using MLO-technology give wireless device makers the competitive edge they are looking for.
Narayan Bhat is a contributing editor for TMCnet. To read more Bhat’s articles, please visit his TMCnet columnist page.