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CES Feature Articles

January 04, 2013

TI Collaborates With SoftKinetic To Unveil 3D Image Sensor Chipset At CES 2013

Texas Instruments (News - Alert) (TI), a global semiconductor design & manufacturing company is collaborating with SoftKinetic, a leading provider of end-to-end 3D middleware solutions to enable the mainstream adoption of 3D sensor and gesture recognition middleware solutions technology.

TI has been at the forefront of technical innovation for more than 80 years now. TI’s collaboration with SoftKinetic will increase the adoption of gesture control in Personal Computers, Televisions and other devices.

TI will be demonstrating its new 3D time-of-flight image sensor chipset tracking at Consumer Electronics Show, CES (News - Alert) 2013 which is to be held in the TI Village, North Hall of the Las Vegas Convention Center. The sensor chip after integrating with SoftKinetic’s DepthSense pixel technology runs gesture recognition middleware for hand, finger and full-body tracking.

3D cameras will be embedded with TI chipset. The cameras will then control access and navigation of movies, games and other content with the wave of the hand in smart TV and laptop. TI’s demonstration will also feature TI's OMAP 5 processor which powers natural user interface with full HD graphics and impressive gesture recognition.

"SoftKinetic has long believed that motion control and gesture recognition is the future of user interfaces and digital interactivity," said Michel Tombroff, chief executive officer of SoftKinetic. "We are pleased to collaborate with TI to help bring this technology into the mass market, and look forward to having our technology impact the everyday lives of consumers."

Current 3D gesture recognition solutions are sluggish and lack real-time tracking. By employing SoftKinetic’s DepthSense pixel technology TI's Time-of-F light chipset delivers real-time tracking responsiveness with precision.

"There are a plethora of applications that can benefit from the accuracy and resolution of this technology," said Gaurang Shah, vice president of Audio and Imaging Products at TI. "Imagine an end equipment designer tilting, rotating, compressing and expanding a new product in 3D to inspect and evaluate it on their PC before committing to a hardware prototype. We believe our collaboration with SoftKinetic will ignite more applications like this, and foster further technology innovation to simplify the way we interact with machines."

Edited by Carlos Olivera

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