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Siemon Announces New Passive Copper Cabling Assemblies
[February 17, 2010]

Siemon Announces New Passive Copper Cabling Assemblies


TMCnet Contributor
 
Siemon, a global manufacturer of IT network cabling and infrastructure systems, has released 40+Gb/s SFF-8470 4X Passive Copper cabling products.

Officials with Siemon (News - Alert) said that these SFF-8470 copper cable assemblies support high-speed interconnect applications such as high-performance computing “HPC,” enterprise networking and network storage systems. The low latency assemblies support data transfer rates from 2.5Gb/s to 10+ Gb/s per lane.

Company officials said that Siemon’s 8470 cable assemblies feature a shielded wafer construction where the signal conductors are directly attached to the connector's contacts eliminating a printed circuit board and enhancing noise resistance to maximize signal integrity.

The twin-axial shielded cable conductors are laser welded reducing cross-talk and jitter to support 10+Gb/s data rates. SFF-8470 die cast back shells and latch is interoperable with all compliant interfaces.


“Siemon's SFF 8470 supports the second generation of the Shielded Multi-Lane SFF-8470 copper cabling standard with data rates through 10+Gb/s per lane for IO interface applications” said Ed Cady, business development manager for Siemon Interconnect Solutions division.

Cady also said that this IO connector interface has had wide standards and value-added interface link design-ins.


 

Anil Sharma is a contributing editor for TMCnet. To read more of Anil’s articles, please visit his columnist page.

Edited by Stefania Viscusi

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