[May 25, 2017]

Global Thermal Interface Materials (TIMs) Market to Grow at a CAGR of 11.3% by 2021 - Key Vendors are Dow Corning, Henkel, Honeywell, Laird & Momentive - Research and Markets

Research and Markets has announced the addition of the "Global Thermal Interface Materials (TIMs) Market 2017-2021" report to their offering.

The global thermal interface materials (TIMs) market to grow at a CAGR of 11.30% during the period 2017-2021.

The report, Global Thermal Interface Materials (TIMs) Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

According to the report, one of the major drivers for this market is advantages of TIM. TIMs are being used as greases and adhesives mainly in manufacturing, defense and aerospace, and wireless networking applications. The use in various applications is attributable to their flowability, reworkability, potential o minimize the surface irregularities and cost-effectiveness. In addition, in medical equipment or devices, such as lasers, ultrasound devices, X-ray machines, and digital imaging equipment, effective thermal management plays an essential role in making the equipment function persistently and accurately within the optimum temperature. This enhances the reliability of the devices, thereby intensifying the demand for TIMs during the forecast period.

Key vendors

• Dow Corning (News - Alert)
• Henkel
• Honeywell
• Laird
• Momentive
  

Other prominent vendors

• 3M (News - Alert)
• Akasa group
• Indium Corporation
• Parker Chomerics
• Zalman
  

Key Topics Covered:

PART 01: Executive summary

PART 02: Scope of the report

PART 03: Research Methodology

PART 04: Introduction

PART 05: Market landscape

PART 06: Market segmentation by application

PART 07: Geographic segmentation

PART 08: Key leading countries

PART 09: Decision framework

PART 10: Drivers and challenges

PART 11: Market trends

PART 12: Vendor landscape

PART 13: Key vendor analysis

PART 14: Appendix

For more information about this report visit http://www.researchandmarkets.com/research/ff5bgc/global_thermal

View source version on businesswire.com: http://www.businesswire.com/news/home/20170525005542/en/

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