[May 22, 2017] |
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Complete Teardown Report of LG's G6 (LGM-G600S) with Full BOM with Cost Benchmarking and Component Analysis - Research and Markets
Research and Markets has announced the addition of the "Teardown
- LG G6 (LGM-G600S)" report to their offering.
Delivered by our team of industry experts, this LG G6 teardown report
features a full BOM with cost benchmarking and component analysis to
help you balance device cost and make decisions critical to your success.
Today's complex global supply chain and rapid technology innovation
necessitate smart component cost and hardware design choices. Our
solutions deliver comprehensive, industry-trusted insights that help you
balance device cost with the features that will satisfy today's highly
competitive marketplace. Delivered by a team of experts with over 13
years of experience, our teardown reports deliver the depth, breadth,
and accuracy you need to make costeffective tactical and strategic
decisions.
Highlights
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Qualcomm (News - Alert) Snapdragon 821, Quad-Core 2.35GHz, MSM8996SG
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64GB UFS NAND, 4GB Mobile DDR4
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13MP Dual Primary Camera, 5MP Secondary Camera
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5.7" TFT-LCD, 2880x1440 w/In-Cell Touchscreen
Each teardown report includes:
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Comprehensive, industry-trusted insights that help you balance device
cost and make cost-effective tactical and strategic decisions
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A complete assessment of all electronic, electro-mechanical, and
mechanical components
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A detailed market, manufacturing, and cost analysis from our team of
industry experts
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An exhaustive photographic inventory of all device components
Key Topics Covered:
I. Executive Dashboard
II. Overall Cost Model
III. IC Price Evaluator
IV. Bill of Materials
V. Cost Estimation
VI. Global Manufacturing Wage Study
VII. Methodology
VIII. Device Overview
For more information about this report visit http://www.researchandmarkets.com/research/fzn5zb/teardown_lg_g6
View source version on businesswire.com: http://www.businesswire.com/news/home/20170522005821/en/
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