[February 24, 2017] |
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Egis Technology Inc. Debuting Under Glass Fingerprint Sensor at MWC Barcelona 2017
Mobile World Congress (News - Alert) - Egis Technology Inc. (TWO:6462), a
leading fingerprint sensor provider, will be debuting its brand new
under glass fingerprint sensor that can be used with a cover glass of
over 1000um at MWC Barcelona 2017 from February 27th to March
2nd at Hall 1, Booth 1G45 in the Fira Gran Via.
Fingerprint sensors which can be placed under the cover glass of mobile
devices are the next step in the evolution of fingerprint sensor
technology. In the past, some lesser technologies have attempted to do
this, but at a cost of system level reliability - a certain area of the
cover glass needs to be etched so that the signal can get through. The
new under cover glass sensor from Egis requires no etching, and will be
able to penetrate over 1000 mcrometers of glass, allowing the user to
have a seamless fingerprint authentication experience without having to
reduce the quality and durability of the phone.
About Egis Technology Inc.
As a leading provider of fingerprint biometrics, Egis Technology Inc.
specializes in providing a total turnkey solution with superior sensor
performance and software functionality. Our proprietary matching
algorithm offers the best FAR/FRR performance in the market while
providing maximum security and convenience. Egis' leading edge
fingerprint technology is the ideal choice for implementation in mobile
devices. As a board member of the FIDO Alliance, Egis aims to provide
security and authentication for all in the online world. Egis is
headquartered in Taipei, Taiwan with branch office located in China,
subsidiaries in Japan and USA. For more information, please visit www.egistec.com.
View source version on businesswire.com: http://www.businesswire.com/news/home/20170224005846/en/
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