The AMD64 Longevity Program has been expanded to include two additional low-power processors based on AMD’s successful mobile products.
With the integration of the Mobile AMD Sempron processor model 3500+ and the AMD Turion 64 X2 dual-core mobile technology Model TL-52 into the AMD64 Longevity Program, designers will be able to innovate at the system-level and deliver leading edge performance.
“AMD is addressing the needs of embedded designers by making more of our products available for those who require longer than standard component availability,” said Greg White, vice president, embedded product division, AMD, in a press release. “Our goal is to empower our embedded customers to create differentiated solutions on a solid, consistent architecture—and by expanding longevity options we are doing just that. This is the first in a series of steps AMD expects to take to broaden its embedded product offerings and support throughout 2007.”
According to the release, several companies are already planning to design their next generation embedded products on these AMD processors, including Accrosser, Albatron, Aopen, Axxtend, EPoX and ICP.
AMD claims that these low-power processors offer a specific balance of performance, packaging features and thermal envelopes to meet customers’ needs for embedded processors.
Both the Mobile AMD Sempron Processor model 3500+ and the AMD Turion 64 X2 dual-core mobile technology model TL-52 come with various useful features such as direct access to the die from the heat sink, superb thermal management for smaller form factors etc.
AMD64 develops the industry-standard 32-bit x86 architecture to support the 64-bit environment facilitating future generations of computer functionality and productivity. AMD has designed the AMD64 platform to allow end users to enjoy reliable, best-in-class performance on the 32-bit software they own today while preparing for a seamless transition to high-performance 64-bit applications.
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Niladri Sekhar Nath is a contributing writer for TMCnet covering telecommunications, service providers and networking. To see more of his articles, please visit his columnist page.