TMCnet News
Mosaic Microsystems Announces Strategic Hire: Andrew Garland Joins as Sr. Process Engineer to Drive Next-Gen Glass Interposer Packaging SolutionsROCHESTER, N.Y., April 11, 2024 /PRNewswire/ -- Mosaic Microsystems, a leader in the field of microelectronic glass packaging solutions using glass substrate, announced today the addition of Andrew Garland to its engineering team as a process engineer. With a rich background in image sensor package design and assembly engineering, Andrew brings a wealth of experience and a proven track record of driving technological advancements, process improvement, and leadership to Mosaic Microsystems. Mr. Garland's most recent efforts have been in the field of wafer-level chip-scale package (WLCSP) design, carrying designs from concept to qualification. This includes work that has resulted in two pending patents for novel WLCSP design. Andrew also brings along prior production experience, where he managed engineering activitie for package assembly. "Andrew is a great addition to the production team," said Brian Harding, Senior Production Manager at Mosaic. "His process engineering experience in the area of backend assembly will be vital as we scale and expand our current product offerings." About Mosaic Microsystems: Contact Information: View original content to download multimedia:https://www.prnewswire.com/news-releases/mosaic-microsystems-announces-strategic-hire-andrew-garland-joins-as-sr-process-engineer-to-drive-next-gen-glass-interposer-packaging-solutions-302113134.html SOURCE Mosaic Microsystems |