Semiconductor chip packaging market size to grow by USD 489.22 billion from 2022 to 2027, Growing investment in fabrication facilities to drive growth - Technavio

NEW YORK, May 10, 2023 /PRNewswire/ -- The semiconductor chip packaging market size is set to grow by USD 489.22 billion during 2022-2027 at a CAGR of 27.69% during the forecast period, according to Technavio Research. The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. For more insights on CAGR and YOY growth rate, Download a sample report. 

The market is fragmented, and the degree of fragmentation will accelerate during the forecast period. In a bid to help players strengthen their market foothold, this semiconductor chip packaging market forecast report provides a detailed analysis of the leading market vendors. The report also empowers industry honchos with information on the competitive landscape and insights into the different product offerings offered by various companies. 

Frequently asked questions:

• Based on segmentation by packaging, which is the leading segment in the market?
  The 3DIC TSV stacks segment is the leading segment in the market.
• What are the major trends in the market? 
  The growing investments in lower technology node is a major trend in the market.
• At what rate is the market projected to grow?
  The market is estimated to grow at a CAGR of 27.69% between 2022 and 2027.
• Who are the top players in the market?
  3M Co., Amkor Technology Inc., Applied Materials Inc., ASE Technology Holding Co. Ltd., ASM Pacific Technology Ltd., ChipMOS TECHNOLOGIES Inc., GlobalFoundaries US Inc., Greatek Electronics Inc., Jiangsu Changdian Technology Co. Ltd., Kulicke and Soffa Industries Inc., Microchip Technology Inc., nepes Corp., Powertech Technology Inc., SkyWater Technology Inc., SUSS MICROTEC SE, Taiwan Semiconductor Manufacturing Co. Ltd., Tokyo Electron Ltd., Unisem M Berhad, UTAC Holdings Ltd., and Veeco Instruments Inc. are some of the major market participants.
• What are the key market drivers and challenges?
  The growing investment in fabrication facilities is driving market growth, although factors such as high initial investment may challenge market growth.
• How big is the APAC market?
  APAC is estimated to account for 76% of the growth of the global market during the forecast period.

Semiconductor chip packaging market 2023-2027: Segmentation

• Packaging 
• 3DIC TSV Stacks
• 2.5D interposers
• Flip-chip wafer bumping
• FO WLP/SiP
• Others
• End-user 
• OSATs
• IDMs
• Geography 
• APAC
• North America
• Europe
• South America
• Middle East And Africa

The 3DIC TSV stacks segment will account for a significant share of market growth during the forecast period. TSV platforms are popular due to the growing need for improved functionality, performance, and integration. 3D TSV technology is used for high-end memory applications, MEMS, sensors, RF filters, and power applications. The scope of this technology will expand to applications such as photonics and the integration of LED functionality in the future. Therefore, the demand for 3DIC TSV stack technology is expected to increase during the forecast period, which, in turn, will drive the growth of the segment.

The report comprises of various segments as well as analysis of the trends and factors
that are playing a substantial role in the market, download a sample

Semiconductor chip packaging market 2023-2027: scope

Technavio presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources. The semiconductor chip packaging market report covers the following areas:

• Semiconductor chip packaging market size
• Semiconductor chip packaging market trends
• Semiconductor chip packaging market industry analysis

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Semiconductor chip packaging market 2023-2027: Vendor analysis

There are several vendors in the market. The major players mainly focus on developing innovative products and are constantly increasing their R&D investments. The market is highly competitive, and established vendors are acquiring smaller and regional players. This will help them expand their global presence and increase their market share during the forecast period. The key offerings of some of the vendors are listed below:

• Amkor Technology Inc. - The company offers semiconductor chip packaging solutions, which range from traditional lead frame ICs for through-hole and surface mounting to those required in high pin count and high-density applications such as stacked die, wafer level, MEMS, optical, flip chip, through silicon and 3D packaging.
• Applied Materials Inc. - The company offers semiconductor chip packaging solutions by using a broad suite of equipment for advanced packaging, including ECD, PVD, etch, CVD, and CMP, which enables customers to implement any packaging scheme.
• ASE Technology Holding Co. Ltd. - The company offers semiconductor chip packaging solutions under the brand Siliconware Precision Industries Co. Ltd.
• ASM Pacific Technology Ltd. - The company offers semiconductor chip packaging solutions for the microelectronics, semiconductor, photonics, and optoelectronics industries by offering a diverse product range, from bonding to molding and trims and form to the integration of these activities into complete in-line systems.

Semiconductor chip packaging market 2023-2027: Driver

The growing investment in fabrication facilities is driving market growth. Memory device manufacturers are investing in new manufacturing facilities to increase production capacity and remain competitive in the market. The rising demand for 3D NAND has created opportunities for supply chain members, which is driving investments in 3D NAND manufacturing equipment. For instance, in July 2021, Macronix International Co announced its plan to allocate USD 1.48 billion to expand the 12-inch wafer capacity for advanced 3D NAND and NOR flash memory chips. Such investments are expected to lower the cost of 3D NAND memory. This will drive the demand for memory devices and, in turn, will fuel market growth during the forecast period.

Semiconductor Chip Packaging Market 2023-2027: Challenge

The high initial investment will challenge market growth during the forecast period. The rising demand for compact ICs and the emergence of new 3D packaging solutions have transformed the semiconductor IC manufacturing process. Moreover, this process is complex, time-consuming, and has a high risk of defects, which, in turn, increases the cost of manufacturing. Rapid technological changes are compelling vendors to opt for efficient equipment, which increases the total cost of ownership of the equipment. As a result, many companies are going fabless, which is reducing the number of potential customers. These factors will impede market growth during the forecast period.

Semiconductor chip packaging market 2023-2027: Key highlights

• CAGR of the market during the forecast period 2023-2027
• Detailed information on factors that will assist semiconductor chip packaging market growth during the next five years
• Estimation of the semiconductor chip packaging market size and its contribution to the parent market
• Predictions on upcoming trends and changes in consumer behavior
• The growth of the semiconductor chip packaging market across APAC, North America, Europe, South America, and Middle East and Africa
• Analysis of the market's competitive landscape and detailed information on vendors
• Comprehensive details of factors that will challenge the growth of semiconductor chip packaging market vendors

What's new?

• Special coverage on the Russia-Ukraine war; global inflation; recovery analysis from COVID-19; supply chain disruptions, global trade tensions; and risk of recession
• Global competitiveness and key competitor positions
• Market presence across multiple geographical footprints - Strong/active/niche/trivial - Buy the report!

Related reports

The semiconductor advanced packaging market is estimated to grow at a CAGR of 8.5% between 2022 and 2027. The size of the market is forecast to increase by USD 21,157.5 million. This report extensively covers market segmentation by type (analog and mixed ICs, MEMs and sensors, logic and memory devices, wireless connectivity devices, and CMOS image sensors), technology (flip chip, FI WLP, 2.5d/3d, and FO WLP), and geography (APAC, North America, Europe, South America, and Middle east and Africa).

The semiconductor foundry market is estimated to grow at a CAGR of 7.74% between 2022 and 2027. The size of the market is forecasted to increase by USD 42,781.83 million. This report extensively covers market segmentation by type (pure-play foundries and IDMs), application (communications, PCs/desktops, consumers, automotive, and others), and geography (North America, APAC, Europe, South America, and Middle East and Africa).

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Table of contents:

1 Executive Summary

• 1.1 Market overview 
• Exhibit 01: Executive Summary – Chart on Market Overview
• Exhibit 02: Executive Summary – Data Table on Market Overview
• Exhibit 03: Executive Summary – Chart on Global Market Characteristics
• Exhibit 04: Executive Summary – Chart on Market by Geography
• Exhibit 05: Executive Summary – Chart on Market Segmentation by Packaging
• Exhibit 06: Executive Summary – Chart on Market Segmentation by End-user
• Exhibit 07: Executive Summary – Chart on Incremental Growth
• Exhibit 08: Executive Summary – Data Table on Incremental Growth
• Exhibit 09: Executive Summary – Chart on Vendor Market Positioning

2 Market Landscape

• 2.1 Market ecosystem 
• Exhibit 10: Parent market
• Exhibit 11: Market Characteristics

3 Market Sizing

• 3.1 Market definition 
• Exhibit 12: Offerings of vendors included in the market definition

• 3.2 Market segment analysis 
• Exhibit 13: Market segments

• 3.3 Market size 2022

• 3.4 Market outlook: Forecast for 2022-2027
• Exhibit 14: Chart on Global - Market size and forecast 2022-2027 ($ billion)
• Exhibit 15: Data Table on Global - Market size and forecast 2022-2027 ($ billion)
• Exhibit 16: Chart on Global Market: Year-over-year growth 2022-2027 (%)
• Exhibit 17: Data Table on Global Market: Year-over-year growth 2022-2027 (%)

4 Historic Market Size

• 4.1 Global semiconductor chip packaging market 2017 - 2021 
• Exhibit 18: Historic Market Size – Data Table on Global semiconductor chip packaging market 2017 - 2021 ($ billion)

• 4.2 End-user Segment Analysis 2017 - 2021
• Exhibit 19: Historic Market Size – End-user Segment 2017 - 2021 ($ billion)

• 4.3 Packaging Segment Analysis 2017 - 2021
• Exhibit 20: Historic Market Size – Packaging Segment 2017 - 2021 ($ billion)

• 4.4 Geography Segment Analysis 2017 - 2021
• Exhibit 21: Historic Market Size – Geography Segment 2017 - 2021 ($ billion)

• 4.5 Country Segment Analysis 2017 - 2021
• Exhibit 22: Historic Market Size – Country Segment 2017 - 2021 ($ billion)

5 Five Forces Analysis

• 5.1 Five forces summary 
• Exhibit 23: Five forces analysis - Comparison between 2022 and 2027

• 5.2 Bargaining power of buyers 
• Exhibit 24: Chart on Bargaining power of buyers – Impact of key factors 2022 and 2027

• 5.3 Bargaining power of suppliers 
• Exhibit 25: Bargaining power of suppliers – Impact of key factors in 2022 and 2027

• 5.4 Threat of new entrants 
• Exhibit 26: Threat of new entrants – Impact of key factors in 2022 and 2027

• 5.5 Threat of substitutes 
• Exhibit 27: Threat of substitutes – Impact of key factors in 2022 and 2027

• 5.6 Threat of rivalry 
• Exhibit 28: Threat of rivalry – Impact of key factors in 2022 and 2027

• 5.7 Market condition 
• Exhibit 29: Chart on Market condition - Five forces 2022 and 2027

6 Market Segmentation by Packaging

• 6.1 Market segments 
• Exhibit 30: Chart on Packaging - Market share 2022-2027 (%)
• Exhibit 31: Data Table on Packaging - Market share 2022-2027 (%)

• 6.2 Comparison by Packaging 
• Exhibit 32: Chart on Comparison by Packaging
• Exhibit 33: Data Table on Comparison by Packaging

• 6.3 3DIC TSV stacks - Market size and forecast 2022-2027
• Exhibit 34: Chart on 3DIC TSV stacks - Market size and forecast 2022-2027 ($ billion)
• Exhibit 35: Data Table on 3DIC TSV stacks - Market size and forecast 2022-2027 ($ billion)
• Exhibit 36: Chart on 3DIC TSV stacks - Year-over-year growth 2022-2027 (%)
• Exhibit 37: Data Table on 3DIC TSV stacks - Year-over-year growth 2022-2027 (%)

• 6.4 2.5D interposers - Market size and forecast 2022-2027
• Exhibit 38: Chart on 2.5D interposers - Market size and forecast 2022-2027 ($ billion)
• Exhibit 39: Data Table on 2.5D interposers - Market size and forecast 2022-2027 ($ billion)
• Exhibit 40: Chart on 2.5D interposers - Year-over-year growth 2022-2027 (%)
• Exhibit 41: Data Table on 2.5D interposers - Year-over-year growth 2022-2027 (%)

• 6.5 Flip-chip wafer bumping - Market size and forecast 2022-2027 
• Exhibit 42: Chart on Flip-chip wafer bumping - Market size and forecast 2022-2027 ($ billion)
• Exhibit 43: Data Table on Flip-chip wafer bumping - Market size and forecast 2022-2027 ($ billion)
• Exhibit 44: Chart on Flip-chip wafer bumping - Year-over-year growth 2022-2027 (%)
• Exhibit 45: Data Table on Flip-chip wafer bumping - Year-over-year growth 2022-2027 (%)

• 6.6 FO WLP/SiP - Market size and forecast 2022-2027
• Exhibit 46: Chart on FO WLP/SiP - Market size and forecast 2022-2027 ($ billion)
• Exhibit 47: Data Table on FO WLP/SiP - Market size and forecast 2022-2027 ($ billion)
• Exhibit 48: Chart on FO WLP/SiP - Year-over-year growth 2022-2027 (%)
• Exhibit 49: Data Table on FO WLP/SiP - Year-over-year growth 2022-2027 (%)

• 6.7 Others - Market size and forecast 2022-2027
• Exhibit 50: Chart on Others - Market size and forecast 2022-2027 ($ billion)
• Exhibit 51: Data Table on Others - Market size and forecast 2022-2027 ($ billion)
• Exhibit 52: Chart on Others - Year-over-year growth 2022-2027 (%)
• Exhibit 53: Data Table on Others - Year-over-year growth 2022-2027 (%)

• 6.8 Market opportunity by Packaging 
• Exhibit 54: Market opportunity by Packaging ($ billion)
• Exhibit 55: Data Table on Market opportunity by Packaging ($ billion)

7 Market Segmentation by End-user

• 7.1 Market segments 
• Exhibit 56: Chart on End-user - Market share 2022-2027 (%)
• Exhibit 57: Data Table on End-user - Market share 2022-2027 (%)

• 7.2 Comparison by End-user 
• Exhibit 58: Chart on Comparison by End-user
• Exhibit 59: Data Table on Comparison by End-user

• 7.3 OSATs - Market size and forecast 2022-2027
• Exhibit 60: Chart on OSATs - Market size and forecast 2022-2027 ($ billion)
• Exhibit 61: Data Table on OSATs - Market size and forecast 2022-2027 ($ billion)
• Exhibit 62: Chart on OSATs - Year-over-year growth 2022-2027 (%)
• Exhibit 63: Data Table on OSATs - Year-over-year growth 2022-2027 (%)

• 7.4 IDMs - Market size and forecast 2022-2027
• Exhibit 64: Chart on IDMs - Market size and forecast 2022-2027 ($ billion)
• Exhibit 65: Data Table on IDMs - Market size and forecast 2022-2027 ($ billion)
• Exhibit 66: Chart on IDMs - Year-over-year growth 2022-2027 (%)
• Exhibit 67: Data Table on IDMs - Year-over-year growth 2022-2027 (%)

• 7.5 Market opportunity by End-user 
• Exhibit 68: Market opportunity by End-user ($ billion)
• Exhibit 69: Data Table on Market opportunity by End-user ($ billion)

8 Customer Landscape

• 8.1 Customer landscape overview 
• Exhibit 70: Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria

9 Geographic Landscape

• 9.1 Geographic segmentation 
• Exhibit 71: Chart on Market share by geography 2022-2027 (%)
• Exhibit 72: Data Table on Market share by geography 2022-2027 (%)

• 9.2 Geographic comparison 
• Exhibit 73: Chart on Geographic comparison
• Exhibit 74: Data Table on Geographic comparison

• 9.3 APAC - Market size and forecast 2022-2027
• Exhibit 75: Chart on APAC - Market size and forecast 2022-2027 ($ billion)
• Exhibit 76: Data Table on APAC - Market size and forecast 2022-2027 ($ billion)
• Exhibit 77: Chart on APAC - Year-over-year growth 2022-2027 (%)
• Exhibit 78: Data Table on APAC - Year-over-year growth 2022-2027 (%)

• 9.4 North America - Market size and forecast 2022-2027
• Exhibit 79: Chart on North America - Market size and forecast 2022-2027 ($ billion)
• Exhibit 80: Data Table on North America - Market size and forecast 2022-2027 ($ billion)
• Exhibit 81: Chart on North America - Year-over-year growth 2022-2027 (%)
• Exhibit 82: Data Table on North America - Year-over-year growth 2022-2027 (%)

• 9.5 Europe - Market size and forecast 2022-2027
• Exhibit 83: Chart on Europe - Market size and forecast 2022-2027 ($ billion)
• Exhibit 84: Data Table on Europe - Market size and forecast 2022-2027 ($ billion)
• Exhibit 85: Chart on Europe - Year-over-year growth 2022-2027 (%)
• Exhibit 86: Data Table on Europe - Year-over-year growth 2022-2027 (%)

• 9.6 South America - Market size and forecast 2022-2027
• Exhibit 87: Chart on South America - Market size and forecast 2022-2027 ($ billion)
• Exhibit 88: Data Table on South America - Market size and forecast 2022-2027 ($ billion)
• Exhibit 89: Chart on South America - Year-over-year growth 2022-2027 (%)
• Exhibit 90: Data Table on South America - Year-over-year growth 2022-2027 (%)

• 9.7 Middle East and Africa - Market size and forecast 2022-2027 
• Exhibit 91: Chart on Middle East and Africa - Market size and forecast 2022-2027 ($ billion)
• Exhibit 92: Data Table on Middle East and Africa - Market size and forecast 2022-2027 ($ billion)
• Exhibit 93: Chart on Middle East and Africa - Year-over-year growth 2022-2027 (%)
• Exhibit 94: Data Table on Middle East and Africa - Year-over-year growth 2022-2027 (%)

• 9.8 China - Market size and forecast 2022-2027
• Exhibit 95: Chart on China - Market size and forecast 2022-2027 ($ billion)
• Exhibit 96: Data Table on China - Market size and forecast 2022-2027 ($ billion)
• Exhibit 97: Chart on China - Year-over-year growth 2022-2027 (%)
• Exhibit 98: Data Table on China - Year-over-year growth 2022-2027 (%)

• 9.9 US - Market size and forecast 2022-2027
• Exhibit 99: Chart on US - Market size and forecast 2022-2027 ($ billion)
• Exhibit 100: Data Table on US - Market size and forecast 2022-2027 ($ billion)
• Exhibit 101: Chart on US - Year-over-year growth 2022-2027 (%)
• Exhibit 102: Data Table on US - Year-over-year growth 2022-2027 (%)

• 9.10 Taiwan - Market size and forecast 2022-2027
• Exhibit 103: Chart on Taiwan - Market size and forecast 2022-2027 ($ billion)
• Exhibit 104: Data Table on Taiwan - Market size and forecast 2022-2027 ($ billion)
• Exhibit 105: Chart on Taiwan - Year-over-year growth 2022-2027 (%)
• Exhibit 106: Data Table on Taiwan - Year-over-year growth 2022-2027 (%)

• 9.11 Japan - Market size and forecast 2022-2027
• Exhibit 107: Chart on Japan - Market size and forecast 2022-2027 ($ billion)
• Exhibit 108: Data Table on Japan - Market size and forecast 2022-2027 ($ billion)
• Exhibit 109: Chart on Japan - Year-over-year growth 2022-2027 (%)
• Exhibit 110: Data Table on Japan - Year-over-year growth 2022-2027 (%)

• 9.12 South Korea - Market size and forecast 2022-2027
• Exhibit 111: Chart on South Korea - Market size and forecast 2022-2027 ($ billion)
• Exhibit 112: Data Table on South Korea - Market size and forecast 2022-2027 ($ billion)
• Exhibit 113: Chart on South Korea - Year-over-year growth 2022-2027 (%)
• Exhibit 114: Data Table on South Korea - Year-over-year growth 2022-2027 (%)

• 9.13 Market opportunity by geography 
• Exhibit 115: Market opportunity by geography ($ billion)
• Exhibit 116: Data Tables on Market opportunity by geography ($ billion)

10 Drivers, Challenges, and Trends

• 10.1 Market drivers

• 10.2 Market challenges

• 10.3 Impact of drivers and challenges 
• Exhibit 117: Impact of drivers and challenges in 2022 and 2027

• 10.4 Market trends

11 Vendor Landscape

• 11.1 Overview

• 11.2 Vendor landscape 
• Exhibit 118: Overview on Criticality of inputs and Factors of differentiation

• 11.3 Landscape disruption 
• Exhibit 119: Overview on factors of disruption

• 11.4 Industry risks 
• Exhibit 120: Impact of key risks on business

12 Vendor Analysis

• 12.1 Vendors covered 
• Exhibit 121: Vendors covered

• 12.2 Market positioning of vendors 
• Exhibit 122: Matrix on vendor position and classification

• 12.3 3M Co. 
• Exhibit 123: 3M Co. - Overview
• Exhibit 124: 3M Co. - Business segments
• Exhibit 125: 3M Co. - Key news
• Exhibit 126: 3M Co. - Key offerings
• Exhibit 127: 3M Co. - Segment focus

• 12.4 Amkor Technology Inc. 
• Exhibit 128: Amkor Technology Inc. - Overview
• Exhibit 129: Amkor Technology Inc. - Business segments
• Exhibit 130: Amkor Technology Inc. - Key offerings
• Exhibit 131: Amkor Technology Inc. - Segment focus

• 12.5 Applied Materials Inc. 
• Exhibit 132: Applied Materials Inc. - Overview
• Exhibit 133: Applied Materials Inc. - Business segments
• Exhibit 134: Applied Materials Inc. - Key offerings
• Exhibit 135: Applied Materials Inc. - Segment focus

• 12.6 ASE Technology Holding Co. Ltd. 
• Exhibit 136: ASE Technology Holding Co. Ltd. - Overview
• Exhibit 137: ASE Technology Holding Co. Ltd. - Business segments
• Exhibit 138: ASE Technology Holding Co. Ltd. - Key offerings
• Exhibit 139: ASE Technology Holding Co. Ltd. - Segment focus

• 12.7 ASM Pacific Technology Ltd. 
• Exhibit 140: ASM Pacific Technology Ltd. - Overview
• Exhibit 141: ASM Pacific Technology Ltd. - Business segments
• Exhibit 142: ASM Pacific Technology Ltd. - Key offerings
• Exhibit 143: ASM Pacific Technology Ltd. - Segment focus

• 12.8 ChipMOS TECHNOLOGIES Inc. 
• Exhibit 144: ChipMOS TECHNOLOGIES Inc. - Overview
• Exhibit 145: ChipMOS TECHNOLOGIES Inc. - Business segments
• Exhibit 146: ChipMOS TECHNOLOGIES Inc. - Key offerings
• Exhibit 147: ChipMOS TECHNOLOGIES Inc. - Segment focus

• 12.9 Greatek Electronics Inc. 
• Exhibit 148: Greatek Electronics Inc. - Overview
• Exhibit 149: Greatek Electronics Inc. - Product / Service
• Exhibit 150: Greatek Electronics Inc. - Key offerings

• 12.10 Jiangsu Changdian Technology Co. Ltd.
• Exhibit 151: Jiangsu Changdian Technology Co. Ltd. - Overview
• Exhibit 152: Jiangsu Changdian Technology Co. Ltd. - Product / Service
• Exhibit 153: Jiangsu Changdian Technology Co. Ltd. - Key offerings

• 12.11 Kulicke and Soffa Industries Inc.
• Exhibit 154: Kulicke and Soffa Industries Inc. - Overview
• Exhibit 155: Kulicke and Soffa Industries Inc. - Business segments
• Exhibit 156: Kulicke and Soffa Industries Inc. - Key offerings
• Exhibit 157: Kulicke and Soffa Industries Inc. - Segment focus

• 12.12 Microchip Technology Inc. 
• Exhibit 158: Microchip Technology Inc. - Overview
• Exhibit 159: Microchip Technology Inc. - Business segments
• Exhibit 160: Microchip Technology Inc. - Key offerings
• Exhibit 161: Microchip Technology Inc. - Segment focus

• 12.13 nepes Corp. 
• Exhibit 162: nepes Corp. - Overview
• Exhibit 163: nepes Corp. - Product / Service
• Exhibit 164: nepes Corp. - Key offerings

• 12.14 Powertech Technology Inc. 
• Exhibit 165: Powertech Technology Inc. - Overview
• Exhibit 166: Powertech Technology Inc. - Business segments
• Exhibit 167: Powertech Technology Inc. - Key offerings
• Exhibit 168: Powertech Technology Inc. - Segment focus

• 12.15 Tokyo Electron Ltd. 
• Exhibit 169: Tokyo Electron Ltd. - Overview
• Exhibit 170: Tokyo Electron Ltd. - Business segments
• Exhibit 171: Tokyo Electron Ltd. - Key offerings
• Exhibit 172: Tokyo Electron Ltd. - Segment focus

• 12.16 Unisem M Berhad 
• Exhibit 173: Unisem M Berhad - Overview
• Exhibit 174: Unisem M Berhad - Product / Service
• Exhibit 175: Unisem M Berhad - Key offerings

• 12.17 Veeco Instruments Inc. 
• Exhibit 176: Veeco Instruments Inc. - Overview
• Exhibit 177: Veeco Instruments Inc. - Product / Service
• Exhibit 178: Veeco Instruments Inc. - Key news
• Exhibit 179: Veeco Instruments Inc. - Key offerings

13 Appendix

• 13.1 Scope of the report

• 13.2 Inclusions and exclusions checklist
• Exhibit 180: Inclusions checklist
• Exhibit 181: Exclusions checklist

• 13.3 Currency conversion rates for US$ 
• Exhibit 182: Currency conversion rates for US$

• 13.4 Research methodology 
• Exhibit 183: Research methodology
• Exhibit 184: Validation techniques employed for market sizing
• Exhibit 185: Information sources

• 13.5 List of abbreviations 
• Exhibit 186: List of abbreviations

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