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CEVA to Showcase Latest Wireless Connectivity and Smart Sensing Solutions at embedded world 2023NUREMBERG, Germany, March 9, 2023 /PRNewswire/ -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies and co-creation solutions, will be showcasing a broad range of technologies for smart and connected Edge AI devices at embedded world 2023, March 14-16, in Nuremburg, Germany. Visit CEVA's booth #3A-611 at the show to meet with CEVA technical experts and interact with CEVA's best-in-class technologies on display, including:
To arrange a meeting with CEVA's experts attending the show, contact [email protected]. About CEVA, Inc. Our DSP-based solutions include platforms for 5G baseband processing in mobile, IoT and infrastructure, advanced imaging and computer vision for any camera-enabled device, audio/voice/speech and ultra-low-power always-on/sensing applications for multiple IoT markets. For motion sensing solutions, our Hillcrest Labs sensor processing technologies provide a broad range of sensor fusion software and inertial measurement unit ("IMU") solutions for markets including hearables, wearables, AR/VR, PC, robotics, remote controls and IoT. For wireless IoT, our platforms for Bluetooth connectivity (low energy and dual mode), Wi-Fi 4/5/6 (802.11n/ac/ax), Ultra-wideband (UWB), NB-IoT and GNSS are the most broadly licensed connectivity platforms in the industry. Visit us at www.ceva-dsp.com/ and follow us on Twitter, YouTube, Facebook, LinkedIn and Instagram. Logo: https://mma.prnewswire.com/media/74483/ceva__inc__logo.jpg
View original content:https://www.prnewswire.com/news-releases/ceva-to-showcase-latest-wireless-connectivity-and-smart-sensing-solutions-at-embedded-world-2023-301767602.html SOURCE CEVA, Inc. |