TMCnet News

Global Wafer-level Packaging Equipment Industry (2020 to 2027) - Market Trends and Drivers
[February 01, 2021]

Global Wafer-level Packaging Equipment Industry (2020 to 2027) - Market Trends and Drivers


DUBLIN, Feb. 1, 2021 /PRNewswire/ -- The "Wafer-level Packaging Equipment - Global Market Trajectory & Analytics" report has been added to ResearchAndMarkets.com's offering.

Research and Markets Logo

The publisher brings years of research experience to the 9th edition of this report. The 97-page report presents concise insights into how the pandemic has impacted production and the buy side for 2020 and 2021. A short-term phased recovery by key geography is also addressed.

Global Wafer-level Packaging Equipment Market to Reach $12.1 Billion by 2027

Amid the COVID-19 crisis, the global market for Wafer-level Packaging Equipment estimated at US$3.8 Billion in the year 2020, is projected to reach a revised size of US$12.1 Billion by 2027, growing at a CAGR of 18.2% over the period 2020-2027.

The U.S. Market is Estimated at $1 Billion, While China is Forecast to Grow at 23.4% CAGR

The Wafer-level Packaging Equipent market in the U.S. is estimated at US$1 Billion in the year 2020. China, the world`s second largest economy, is forecast to reach a projected market size of US$2.9 Billion by the year 2027 trailing a CAGR of 23.4% over the analysis period 2020 to 2027. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 13.1% and 16.1% respectively over the 2020-2027 period. Within Europe, Germany is forecast to grow at approximately 14.4% CAGR.




Competitors identified in this market include, among others:

  • Applied Materials, Inc.
  • Disco, Inc.
  • EV Group
  • Rudolph Technologies, Inc.
  • Semes Co., Ltd.
  • Suss MicroTec AG
  • ULVAC Technologies, Inc.

Key Topics Covered:


I. INTRODUCTION, METHODOLOGY & REPORT SCOPE

II. EXECUTIVE SUMMARY

1. MARKET OVERVIEW

  • Global Competitor Market Shares
  • Wafer-level Packaging Equipment Competitor Market Share Scenario Worldwide (in %): 2019 & 2025
  • Impact of Covid-19 and a Looming Global Recession

2. FOCUS ON SELECT PLAYERS

3. MARKET TRENDS & DRIVERS

4. GLOBAL MARKET PERSPECTIVE

III. MARKET ANALYSIS

IV. COMPETITION

  • Total Companies Profiled: 31

For more information about this report visit https://www.researchandmarkets.com/r/gv6t8

Research and Markets also offers Custom Research services providing focused, comprehensive and tailored research.

Media Contact:

Research and Markets
Laura Wood, Senior Manager
[email protected]

For E.S.T Office Hours Call +1-917-300-0470
For U.S./CAN Toll Free Call +1-800-526-8630
For GMT Office Hours Call +353-1-416-8900

U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716

Cision View original content:http://www.prnewswire.com/news-releases/global-wafer-level-packaging-equipment-industry-2020-to-2027---market-trends-and-drivers-301219071.html

SOURCE Research and Markets


[ Back To TMCnet.com's Homepage ]