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Global Flip Chip Market Worth $36.7 Billion by 2026 - Advancements of Copper Pillar and Micro Bumping Metallurgy Driving GrowthDUBLIN, Aug. 26, 2020 /PRNewswire/ -- The "Global Flip Chip Market By Packaging Technology, By Bumping Technology, By End User, By Region, Industry Analysis and Forecast, 2020-2026" report has been added to ResearchAndMarkets.com's offering. The Global Flip Chip Market size is expected to reach $36.7 billion by 2026, rising at a market growth of 8.2% CAGR during the forecast period. Technological dominance over wire bond connections, growing demand for high connectivity devices, retaining high package density and increasing circuit durability are some of the factors driving the flip-chip market. Based on Packaging Technology, the market is segmented into 2.5D IC, 3D IC and 2D IC. Based on Bumping Technology, the market is segmented into Copper Pillar, Gold Bumping, Solder Bumping and Others. Based on End User, the market is segmented into Electronics, Industrial, IT & Telecom, Automotive, Healthcare & Life Sciences, Aerospace & Defense and Others. Based on Regions, the market is segmented into North America, Europe, Asia Pacific, and Latin America, Middle East & Africa. The market research report covers the analysis of key stakeholders of the market. Key companies profiled in the report include 3M Company, Advanced Micro Devices, Inc., Amkor Technology, Inc., Apple, Inc., Fujitsu Limited, Intel Corporation, IBM Corporation, Samsung Electronics Co., Ltd., Texas Instruments, Inc., and Taiwan Semiconductor Manufacturing Company. Key Topics Covered Chapter 1. Market Scope & Methodology 1.1 Market Definition 1.2 Objectives 1.3 Market Scope 1.4 Segmentation 1.4.1 Global Flip Chip Market, by Packaging Technology 1.4.2 Global Flip Chip Market, by Bumping Technology 1.4.3 Global Flip Chip Market, by End User 1.4.4 Global Flip Chip Market, by Geography 1.5 Methodology for the Research Chapter 2. Market Overview 2.1 Introduction 2.1.1 Overview 2.1.2 Executive Summary 2.1.3 Market Composition and Scenario 2.2 Key Factors Impacting the Market 2.2.1 Market Drivers 2.2.2 Market Restraints Chapter 3. Global Flip Chip Market by Packaging Technology 3.1 Global Flip Chip 2.5D IC Market by Region 3.2 Global Flip Chip 3D IC Market by Region 3.3 Global Flip Chip 2D IC Market by Region Chapter 4. Global Flip Chip Market by Bumping Technology 4.1 Global Copper Pillar Flip Chip Market by Region 4.2 Global Gold Bumping Flip Chip Market by Region 4.3 Global Solder Bumping Flip Chip Market by Region 4.4 Global Other Bumping Technology Flip Chip Market by Region Chapter 5. Global Flip Chip Market by End User 5.1 Global Electronics Flip Chip Market by Region 5.2 Global Industrial Flip Chip Market by Region 5.3 Global IT & Telecom Flip Chip Market by Region 5.4 Global Automotive Flip Chip Market by Region 5.5 Global Healthcare & Life Sciences Flip Chip Market by Region 5.6 Global Aerospace & Defense Flip Chip Market by Region 5.7 Global Others Flip Chip Market by Region Chapter 6. Global Flip Chip Market by Region 6.1 North America Flip Chip Market 6.2 Europe Flip Chip Market 6.3 Asia Pacific Flip Chip Market 6.4 LAMEA Flip Chip Market Chapter 7. Company Profiles 7.1 3M Company 7.2 Advanced Micro Devices, Inc. 7.3 Amkor Technology, Inc. 7.4 Apple, Inc. 7.5 Fujitsu Limited 7.6 Intel Corporation 7.7 IBM Corporation 7.8 Samsung Electronics Co. Ltd. (Samsung Group) 7.9 Texas Instruments, Inc. 7.10 Taiwan Semiconductor Manufacturing Company For more information about this report visit https://www.researchandmarkets.com/r/v1aocl Research and Markets also offers Custom Research services providing focused, comprehensive and tailored research.
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