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Global Chip Mounter Market Report 2019: Market Reached a Aalue of US$ 4.1 Billion in 2018 and is Expected to Exceed US$ 5.6 Billion by 2024
[June 28, 2019]

Global Chip Mounter Market Report 2019: Market Reached a Aalue of US$ 4.1 Billion in 2018 and is Expected to Exceed US$ 5.6 Billion by 2024

DUBLIN, June 28, 2019 /PRNewswire/ -- The "Chip Mounter Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2019-2024" report has been added to's offering.

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The global chip mounter market reached a value of US$ 4.1 Billion in 2018. Looking forward, the market to exceed US$ 5.6 Billion by 2024, growing at a CAGR of around 5% during 2019-2024.

The chip mounting technology has experienced significant development over the last few decades and has emerged as a practical solution for achieving higher densities in packaging systems. It was initially introduced as the conventional Through Hole Technology (THT), which later resurfaced as Surface Mount Technology (SMT) and then the Fine Pitch Technology (FPT). Nowadays, the majority of manufacturers utilize both SMT and THT for mounting chips on substrates. These technologies are used in a number of industries which include automotive, telecommunication, medical and electronics.

Market Drivers

On account of factors such as the rising demand for laptops and smartphones, growing internet penetration, and automation in household electronic goods, the consumer electronics industry has experienced robust growth over the past few years. As chip mounters are used to assemble semiconductor components on PCBs in consumer electronics, the escalating demand for these gadgets and appliances is strengthening the growth of the market.

Moreover, electronic chipsets play a vital role in the production of miniature electronic devices where they assist in reducing the dimensions of integrated circuits. With the increasing demand for compact gadgets and wearables, manfacturers are increasingly using these chipsets to reduce the overall size of the devices without affecting their performance.

Apart from this, to keep pace with the rising level of integration, hardware developers are investing in the development of new techniques to manage more circuitry at similar costs.

Key Questions Answered in This Report:

  • How has the global chip mounter market performed so far and how will it perform in the coming years?
  • What are the key regional markets in the global chip mounter industry?
  • What is the breakup of the market based on the technology?
  • What is the breakup of the market based on the application?
  • What are the various stages in the value chain of the global chip mounter industry?
  • What are the key driving factors and challenges in the global chip mounter industry?
  • What is the structure of the global chip mounter industry and who are the key players?
  • What is the degree of competition in the global chip mounter industry?

Key Topics Covered:

1 Preface

2 Scope and Methodology
2.1 Objectives of the Study
2.2 Stakeholders
2.3 Data Sources
2.4 Market Estimation
2.5 Forecasting Methodology

3 Executive Summary

4 Introduction
4.1 Overview
4.2 Key Industry Trends

5 Global Chip Mounter Market
5.1 Market Overview
5.2 Market Performance
5.3 Market Breakup by Technology
5.4 Market Breakup by Application
5.5 Market Breakup by Region
5.6 Market Forecast

6 Market Breakup by Technology
6.1 Hole Technology
6.2 Surface Mount Technology
6.3 Fine Pitch Technology

7 Market Breakup by Application
7.1 Consumer Electronics
7.2 Medical
7.3 Automotive
7.4 Telecommunication
7.5 Others

8 Market Breakup by Region

9 SWOT Analysis
9.1 Overview
9.2 Strengths
9.3 Weaknesses
9.4 Opportunities
9.5 Threats

10 Value Chain Analysis

11 Porters Five Forces Analysis
11.1 Overview
11.2 Bargaining Power of Buyers
11.3 Bargaining Power of Suppliers
11.4 Degree of Competition
11.5 Threat of New Entrants
11.6 Threat of Substitutes

12 Price Analysis

13 Competitive Landscape
13.1 Market Structure
13.2 Key Players
13.3 Profiles of Key Players
13.3.1 Hitachi
13.3.2 Samsung
13.3.3 Panasonic
13.3.4 Juki
13.3.5 ASM Pacific Technology
13.3.6 Canon
13.3.7 Essemtec
13.3.8 Ohashi Engineering
13.3.9 Nordson
13.3.10 Sony
13.3.11 Sun Electronic Industries Corporation
13.3.12 TOA

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