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Global Surface Mount Technology (SMT) Equipment Market 2017-2018 & 2019-2025 - Evolving Role of Smart Factory' to Fuel Sales of Fully Automated SMT PlatformsDUBLIN, June 5, 2019 /PRNewswire/ -- The "Surface Mount Technology (SMT) Equipment: Global Market Analysis, Trends, and Forecasts" report has been added to ResearchAndMarkets.com's offering. This report provides separate comprehensive analytics for the US, Japan, Europe, Asia-Pacific, and Rest of World. Annual estimates and forecasts are provided for the period 2017 through 2025. Also, a five-year historic analysis is provided for these markets. The report analyzes the worldwide markets for Surface Mount Technology (SMT) Equipment in US$ by the following Product Groups/Segments:
The report profiles 69 companies including many key and niche players such as:
Key Topics Covered: 1. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS Trend-Setting Technologies Intensifying R&D to Foster Growth Lead-Free Solder: Emboldens Growth Opportunities Slow But Steady Growth Opportunities for SMT Cleaning Equipment Lead-Free Manufacturing Continues to Drive Demand Difficulties Faced in the Cleaning of Lead-free Equipment APT Drives the Market Impact of Government Regulations on SMT Cleaning Equipment Repair and Rework Emerge as an Integral Part of EMS - Drive Demand for SMT Repair & Rework Equipment Escalating Assembly Costs Drive Demand for Rework Equipment Need for Speed & Flexibility in Electronics Manufacturing Industry Spurs Growth Next Generation Electronics: Opens up Opportunities for SMT Shrinking PCB Size Paints Brighter Prospects Demand for High-Mix' Equipment on Rise Energy Efficient Equipment Come to Fore Amid Clamor for Environment Protection Machine Vision: A Stitch in Time From OEMs to CEMs and EMS Providers: Changing Customer Profile Electronic Contract Manufacturers - Key Consumer Segment of SMT Equipment ECMS Industry: Bitten by Pricing Pressures 4. CHALLENGES AND MARKET RESTRAINTS SMT - Not Completely Free of Defects Purchase Cycles Reward But Also Retard Growth Commoditization Kills Price Differentials Skewed Customer Profile Strains the Margins Used Equipment: The Threat is Real High Entry Barriers Hinder New Market Entrants Density Packing Voices Concerns for High Quality Placement and Inspection High False Calls and Escape Rates Dent Investor Confidence in SMT Inspection Equipment Multiple Technologies Cannibalize Sales for SMT Inspection Equipment Price Sensitivity: A Major Challenge for SMT Equipment Pricing Undercuts Market Leadership Challenges Faced by Advanced Manufacturing Industry Technology Challenges Constant Demand for Improved Processes and Materials Unstable Packaging Difficulty in Reworking Conflicts between Process Capability and Design Requirements Thermal Pad Voiding 5. THE TECH PRIMER SMT - A Curtain Raiser Electronics Packaging Technology Prior to SMT Packaging Without Holes What Drives SMT Market? Benefits of Surface Mounting Higher Functional Density and Spatial Utilization Substantial Reduction in Costs and Board Weights Superior Electrical Performance Shortened Time-to-Market Initial Glitches Type I, II and III Surface Mount Assemblies Types of Surface Mount Packages Small Outline Integrated Circuits (SOICs) Plastic Leaded or Leadless Chip Carriers (PLCCs and LCCs) Chip Scale Packages (CSPs) Ball Grid Arrays (BGAs) Micro Ball Grid Array (microBGAs) Fine Pitch Devices Surface Mounting - A Concise Overview of the Process Defects - Intimidating Challenges to the Board Quality and Performance Sources of Defects Description of Process Related Defects Cost of Defects Surface Mount Design - The First Step Designing Entails 80% of the Cost What are Land Patterns? Some Major Design Considerations Spatial Considerations Component Alignment Considerations Via Holes Number of Test Nodes Prototype Inspection Solder Paste Application/Paste Printing - The Blue Print Important Considerations for Good Quality Printing Why Use Solder Paste? Which Type of Solder Paste to be Used? Prerequisites of an Ideal Solder Paste Regulations on the Usage of Solder Pastes Component Placement - Mounting' Prerequisites for Precise Placement Soldering - Making the Electrical Connections Reflow Soldering Wave Soldering Classification of Solder Joints Good Solder Joint Poor Solder Fillet Shorts Cleaning - Wiping off the Contaminants Impact of Cleaning Processes on Component Choice Inspection - Locating the Defects Visual/Manual Inspection Optical/Laser Inspection X-Ray Inspection Repair and Rework - Setting the Defects Right Functional Testing - The Ultimate Step Emerging Technologies, Challenges and the Roadmap for the Future 6. INNOVATIONS Latest Advancement in SMT Technology Technological Innovations Importance of Absolute Encoder in SMT Placement Smart Feeder Technology Focus on Responsive and Flexible Manufacturing Lines Ensuring Lower Cost and Smaller Footprint 7. PRODUCT OVERVIEW Introduction Classification of SMT Equipment Low-Range/Entry Level Machinery Mid-Range Machinery High-Range/High Level Machinery Used Equipment New Equipment SMT Screen Print Equipment Advantages of Screen Print Equipment Manual Screen Print Equipment Semiautomatic Screen Print Equipment Automatic Screen Print Equipment Screen Printing: Still a Relevant Technology SMT Placement Equipment On Basis of Technology Gantry/Cartesian Robots Turret Placement Systems On Basis of Speed High Speed Placement Systems Medium Speed Placement Systems Low Speed Placement Systems SMT Soldering Equipment Reflow Ovens Design Considerations Wave Ovens SMT Cleaning Equipment Aqueous Cleaning Equipment Semi-Aqueous Solvent Cleaning Equipment Traditional Solvents: Tarnished by Environmental Impact Ultrasonic Cleaning Equipment SMT Inspection Equipment Optical Inspection Systems: Camera Eyes the SMT Lines Manual Inspection Systems Automated Optical Injection Automated Optical Inspection (AOI) Systems Technological Drivers Increasing Circuit Complexity and Density Improvements in Key Technology Components of AOI Systems Miniaturization Drive Advantages of AOIs Optical Inspection Systems for Yield Management Post-Print-Paste Inspection Machines Post-Placement Inspection Machines Post-Reflow Inspection Machines Post Reflow or Post Placement? X-Ray Inspection Equipment: X-Ploring the Unseen Major Design Considerations for Enhanced Performance Focal Spot Size Tube Voltage Geometric Magnification Tube Lifetime Standalone or Inline..? Types of X-Ray Equipment Manual X-Ray Inspection Systems Semi Automated X-Ray Inspection Systems Automated X-Ray Inspection Systems How to Improve Functionality of AXIs? False Failures Escape Rates False Failure Rates and Escape Rates: Striking the Balance Benefits of AXIs 2 Dimensional X-Ray Systems 3 Dimensional X-Ray Systems The Choice of the Ideal System Laser Inspection Systems Prerequisites of Laser Beams for High Precision Inspection Emerging Trends in Inspection Systems Next Gen' Inspection Systems Team up' to Fix' the Problems SMT Repair and Rework Equipment Manual Rework and Repair Equipment Semi-Automatic Rework and Repair Equipment SMT Equipment Markets: A Historic Backdrop After All, It's the Testing Time' 8. COMPETITIVE LANDSCAPE Global Leading Vendors of SMT Equipment Leading Players in World SMT Equipment Market (2018E): Percentage Breakdown of Revenues for ASM Assembly Systems, Fuji, Kulicke & Soffa, Panasonic, Yamaha Motor and Others Leading Players in the Global Automated Optical Inspection (AOI) Systems Market (2013 Historic Data): Percentage Share Breakdown of Value Sales Vendors Resort to Novel Strategies to Gain Competitive Edge Value Added Services Become Key Differentiator Towards Consolidated Endeavors Select M&A Deals in the World SMT Equipment Marketplace 8.1 Focus on Select Key Players 8.2 Product Introductions/Launches Yamaha Motor Introduces YSP10 Solder Paste Printer Mycronic Demonstrates the New MYPro Line Assembly Solution Transition Automation Rolls Out Permalex Universal Holder and Blade Assembly for MPM Edison Printers Saki Bags Support Certification for AOI Systems for Panasonic's APC-MFB2 System SAKI Announces New 3Di AOI System ASM Upgrades SIPLACE TX Electrovert Unveils DwellFlex 4.0 Variable Contact Wave Solder Nozzle Nordson DAGE Introduces Quadra W8 Wafer Inspection System Teradyne Adds DC80+ and DCMUX Options for UltraFLEX Test System Mitsubishi Electric to Introduce MISOP Surface-Mount Package IPM Speedprint Technology Unveils SP1550 Printer Yamaha Motor Unveils New YSi-SP High-speed 3D Solder Paste Inspection Machine Saki Showcases New 3Di AOI Systems Universal Instruments Rolls Out Uflex Automation Platform Universal Instruments Showcases AdvantisV Platform Nordson YESTECH Rolls Out FX-942UV ACI In-Line Dual Sided Optical Inspection System Viscom Introduces New 3D Inspection System with High-Throughput Camera 8.3 Recent Industry Activity MKS Instruments Acquires Electro Scientific Industries Z-AXIS Expands 3D Printing Capabilities at Rochester, New York Facility Sky Power Teams Up with Ersa Soldering Tools KLA-Tencor Snaps Up Orbotech Teradyne Acquires Lemsys BTU International Expands Partnership with CORE-emt to Sweden Glenbrook Technologies Appoints PAKT Electronics as Exclusive Representative in Poland Kulicke & Soffa Inaugurates China Demo Center in Suzhou Facility Saki Teams Up with PAC Global and CEME Cogiscan Inks OEM Reseller Agreement with Universal Instruments Compass Group Equity Partners Acquires Logic PD Fuji Machine Manufacturing Changes Name to FUJI Corporation ITW Establishes ITW EAE Saki Joins ASYS PULSE Community SAKI Inaugurates New Factory in Chiba, Japan Tsinghua University Deploys Fuzion2-60 Platform in its SMT Lab Universal Instruments Appoints SMTo Engineering as Channel Partner in Mexico Mycronic Snaps Up Vi TECHNOLOGY 9. GLOBAL MARKET PERSPECTIVE 10. REGIONAL MARKET PERSPECTIVE 11. COMPANY PROFILES Total Companies Profiled: 69 (including Divisions/Subsidiaries - 85)
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