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Xpeedic Joins GLOBALFOUNDRIES RFwaveTM Partner Program to Speed Time-to-Market for Wireless Connectivity, Radar and 5GXpeedic Technology, Inc. and GLOBALFOUNDRIES today announced the addition of Xpeedic Technology to GF's RFwave Partner Program. The RFwave Partner Program builds upon GF's industry-leading radio frequency (RF) solutions, such as FD-SOI, RF CMOS (bulk and advanced CMOS nodes), RF SOI and silicon germanium (SiGe) technologies. The program provides a low-risk, cost-effective path for designers seeking to build highly optimized RF solutions for a range of wireless applications such as IoT across various wireless connectivity and cellular standards, standalone or transceiver integrated 5G front end modules, mmWave backhaul, automotive radar, small cell and fixed wireless and satellite broadband. "Xpeedic is excited to join GF's RFwaveTM Partner Program. This partnership enables our mutual customers to design RF silicon and system with confidence by adopting Xpeedic's foundry-proven EDA tools, IRIS, which has been certified in GLOBALFOUNDRIES' 22FDX® process technology, and unique passive integration solution for RF front end module design," said Dr. Feng Ling CEO of Xpeedic Technology. "The RFwave program will allow RF design community to access a broad set of innovative RF solutions developed on GF's industry-leading RF technology platform by the RFwave members." "As the RFwave program continues to expand, partners play a critical role in helping to serve our growing number of clients and extend the reach of our RF ecosystem by providing innovative RF-tailored solutions and services," said Mark Ireland, vice president of ecosystem partnerships at GF. "These new partners will help drive deeper engagement and enhance technology collaboration, including tighter interlock around quality, qualification and development methodology, enabling us to deliver advanced highly integrated RF solutions." About Xpeedic Xpeedic Technology, Inc. is a leading provider of EDA solution for IC, package and system designs. The analog/mixed-signal IC tools help IC engineers to shorten their design cycle at the latest advanced semiconductor nodes. The signal integrity tools enable faster design closure for IC package and PCB system designs. The growing IP portfolio on IPD delivers the industry-leading combination of performance and integration to enable SiP for RF front end module designs. These tools and solutions have been widely adopted by companies who make mobile and IoT devices, computing and network systems. Founded in 2010, Xpeedic has offices in both US and China. For more information, please visit www.xpeedic.com.
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