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Research and Markets - Infineon DPS310 Capacitive Pressure Sensor: Structure and Cost Analysis with Comparison of STMicroelectronics Pressure Sensor LPS22HB and the Bosch Sensortec BMP280DUBLIN, Mar 20, 2017 /PRNewswire/ -- Research and Markets has announced the addition of the "Infineon DPS310 Capacitive Pressure Sensor: Structure and Cost Analysis" report to their offering. The first barometric sensor from Infineon for the consumer market is targeting altitude, GPS, indoor and weather forecasting applications in portable devices. This MEMS sensor positions Infineon to compete with STMicroelectronics and Bosch Sensortec. For the DPS310, Infineon has introduced two important innovations. The first is a two-die solution more scalable than the monolithic solution used for some automotive pressure sensors. The second innovation is a plastic metallized lid to replace the classic metal lid. The device comes in a tiny 2×2.5×0.9mm HLGA molded package. The report presents a detailed analysis of the sensor's structure and cost. Comparison with the characteristics of the STMicroelectronics pressure sensor LPS22HB and the Bosch Sensortec BMP280 highlights differences in technical choices made by the companies. Key Topics Covered: Overview / Introduction Company Profile and Supply Chain Physical Analysis Package - Package views and dimensions - Package opening - Package cross-section ASIC die - View, dimensions, and marking - Delayering and process - Cross-section MEMS Die - View, dimensions and marking - Sensing area details - Cross-section sensor capacitor - Cross-section reference capacitor - Process characteristics Comparison Manufacturing Process Flow ASIC front-end process - ASIC wafer fabrication unit - MEMS process flow - MEMS wafer fabrication unit - Packaging process flow - Package assembly unit Cost Analysis Yield hypotheses - ASIC front-end cost - ASIC back-end 0: probe test and dicing - ASIC wafer and die cost - MEMS front-end cost - MEMS back-end 0: probe test and dicing - MEMS front-end cost per process step - MEMS wafer and die cost - Back-end: packaging cost - Back-end: packaging cost per process step - Back-end: final test cost - Pressure sensor component cost Estimated Price Analysis For more information about this report visit http://www.researchandmarkets.com/research/6bl329/infineon_dps310 Media Contact: Research and Markets |