[January 28, 2014] |
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Molex Experts Showcase Products that Meet the Next Wave of Advanced Technology Requirements
LISLE, Ill. --(Business Wire)--
Molex
Incorporated will showcase its deep technical expertise and
extensive product portfolio at DesignCon 2014, January 29 - 30, Santa
Clara, CA, booth 117. Company experts will conduct technical paper
presentations and product demonstrations to illustrate how Molex (News - Alert)
solutions meet the demand for increased network bandwidth and advanced
technology. The company will also have on display a vast representation
of its products that support a wide-range of data rates in a variety of
connector sizes and shapes. These products provide design engineers with
the ultimate in flexible, scalable solutions that deliver speed and
reliability for next-generation system architectures.
Technical Paper Presentations
Molex will conduct two 40-minute sessions that highlight the company's
technical and application expertise:
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Thursday, January 30, 10:15 a.m. - 10:55 a.m. Ballroom J: Molex
experts Patrick Casher, signal integrity engineering manager and
Michael Rowlands, senior electrical engineer, will present
"Quantitative EMI Analysis of Electrical Connectors Using Simulation
Modules." The discussion will focus on a method of using 3D full wave
field solver data to quickly analyze radiated energy across a range of
frequencies to help detect EMI problems more accurately and
efficiently.
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Friday, January 31, 10:40 a.m. - 11:20 a.m. Ballroom G: Peerouz
Amleshi, director; Davi Correia, signal integrity engineer and Cong
Gao, signal integrity engineer with Molex, will join Lin Shen,
principal engineer, Insieme Networks, Inc. in a session titled
"Intra-pair 'Unaccounted' Skew: Effects and Suppression." The team
will present the results of several experiments on the effects of pbc
stack height, trace width, and spacing on trace skew due to variations
of Dk.
Product Demonstrations
Three on-going, live demonstrations will take place in Molex booth 117:
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SpeedStack™
Mezzanine Connector System: Adam Stanczak, global new product
development manager, and Mike Rowlands, senior electrical engineer,
will demonstrate a 28 Gbps channel through the SpeedStack product
family in a 7mm mezzanine stack height. Molex has partnered with
Tekronix to drive a 28 Gbps signal through their BERTScope and display
the output as an eye diagram to validate a clean signal transmission.
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Impel™
Backplane Connector System: Molex will be demonstrating the Impel
backplane technology operating in compliance to OIF (News - Alert) CEI-25G-LR, 28Gbps
on 1m channel using Megtron 6 material and Avago Technologies' leading
edge Vortex Gearbox™ AVSP-1104 IC. The live demonstration will provide
critical channel output through a complete high-speed link, leveraging
Avago's 28nm SerDes technology to transmit 28 Gbps data error-free
through Molex's Impel 6-pair backplane connectors that include
transmit and receive active daughter cards. The Impel backplane
connector demonstration will allow customers to witness and engage
with Molex and Avago technical resources to better understand the
requirements and challenges related to OIF CEI-25G-LR and how Molex
and Avago's innovative solutions can address these requirements.
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zQSFP+™
100 Gbps 4km Long-Reach Silicon Photonics Active Optical Cable
Pigtails Singlemode, long-reach silicon photonics AOCs will
transmit up to 4km with significantly lower power consumption and cost
than other long reach optical solutions. Molex AOC pigtails allow for
connections to singlemode structured cabling up to 4km, and for easy
upgrades when next-generation bandwidth cables are introduced. At
10e-18 BER, Molex AOCs will provide a significantly better bit error
rate than other AOC offerings, thus providing a cost-effective,
high-performance solution for next-generation data center
architectures. Designed to support 100 Gbps Ethernet and EDR
InfiniBand*, Molex zQSFP+ 100 Gbps AOCs will use transceivers based on
silicon photonics ICs, offering vastly improved reliability and cost
advantages over traditional optical modules, while supporting the
rapidly growing use of the industry standard QSFP port.
Product Showcase
The company will display the following solutions from its mezzanine,
I/O, power and edge card connector product lines:
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SpeedStack™
Mezzanine Connector System: Provides PCB real-estate space savings
while optimizing airflow with a low-profile, narrow width, dual row
mezzanine and edge card system to provide stack heights of 4.00mm to
10.00mm, achieving 40+ Gbps per differential pair.
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NeoScale™
High-Speed Mezzanine System: Delivering remarkably clean signal
integrity at data rates of 28+ Gbps, the modular, triad-based
interconnect is designed for high-density printed circuit board (PCB)
mezzanine applications with limited PCB real estate.
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Impel™
Backplane Connector System: Delivers industry-leading signal
integrity and density while providing a scalable price and performance
path that enables customers to migrate to faster data rates (40 Gbps)
without completely re-designing their architecture or replacing
existing hardware.
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Impact™
XTR Daughtercard: A daughtercard enhancement of the Impact product
family, XTR provides an upgrade path for increased signal integrity
margin necessary for evolving high-speed development supporting 25
Gbps+.
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zCD™
Interconnect System: Solves next-generation network
data-transmission challenges with data rates scalable to 400 Gbps (25
Gbps per-serial-lane), excellent signal integrity (SI), electro
magnetic interference (EMI) protection and the ability to support
multiple data center reaches while maintaining excellent thermal
performance.
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iPass+™
High Density (HD) Active Optical Cables (AOCs): Capable of
delivering SAS (News - Alert) 3.0 48 Gbps data rates over four lanes of 12 Gbps with
reaches of up to 100 meters, the cables complement existing copper
iPass+ HD connector and cable offerings and provide large-scale
enterprise and data center storage customers with a complete
end-to-end solution.
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EdgeLine®
High-Speed Edge Card Connectors: Molex recently added new,
high-speed edge card connectors to its EdgeLine portfolio. These
low-profile, one-piece products feature a high-speed differential
contact design that enables speeds of up to 25 Gbps while allowing for
excellent signal integrity.
For more information on Molex solutions please visit www.molex.com/ts/designcon.html.
To receive information on other Molex products and industry solutions,
please sign up for our http://www.molex.com/link/register.
About Molex Incorporated
Providing more than connectors, Molex delivers complete interconnect
solutions for a number of markets including: data communications,
telecommunications, consumer electronics, industrial, automotive,
commercial vehicle, aerospace and defense, medical, and lighting.
Established in 1938, the company operates 45 manufacturing locations in
17 countries. The Molex website is www.molex.com.
Follow us at www.twitter.com/molexconnectors,
watch our videos at www.youtube.com/molexconnectors,
connect with us at www.facebook.com/molexconnectorsand
read our blog at www.connector.com.
Molex is a registered trademark of Molex Incorporated
*InfiniBand is a trademark of the InfiniBand Trade Association
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