IBM Ships Microchips for Nintendo's Wii Video Game System

By Niladri Sekhar Nath

TMCnet Contributing Editor

 

IBM has started shipping the microprocessors which will be used in Nintendo’s upcoming Wii video game console from IBM’s (News - Alert) East Fishkill, NY, fabrication facility. The decision to ship the microprocessors comes after IBM and Nintendo signed a multi-year microchip production agreement earlier this year to support Nintendo’s Wii video game console. The chip, code-named “Broadway” will enhance the performance of video game consoles, claims IBM.

As per the agreement, IBM will manufacture millions of fully tested, Power Architecture-based chips equipped with IBM Silicon on Insulator (SOI) technology at 90 nanometers (90 billionths of a meter). The chips will be based on the specifications of the custom design agreement endorsed by both IBM and Nintendo. IBM will produce the chips at its 300mm semiconductor development and manufacturing facility in East Fishkill, NY

Genyo Takeda, senior managing director/general manager, integrated research and development division, Nintendo, said in a press release that his company has received the first chips. He said, thanks to the chips, Nintendo will be able to “reach both core and nontraditional gamers with an inviting, inclusive and remarkable gaming experience.”


IBM’s Silicon on Insulator technology will prove handy for Nintendo, as it will help the company accomplish a 20 percent reduction in energy consumption. This type of Power Architecture-based microchips is already in use in routers, servers, supercomputers, printers etc.

For more information, visit www.ibm.com.

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Niladri Sekhar Nath is a contributing writer for TMCnet covering telecommunications, service providers and networking.