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Thin Wafer Processing and Dicing Equipment Market to Reach $1.2 billion, Globally, by 2031 at 6.7% CAGR: Allied Market ResearchThe rise in consumer electronics demand and the trend toward smaller electronic devices and the surge in demand for thinner wafers and more robust chips across the world drive the growth of the global thin wafer processing and dicing equipment market PORTLAND, Ore., Feb. 6, 2023 /PRNewswire/ -- Allied Market Research published a report, titled, "Thin Wafer Processing and Dicing Equipment Market by Equipment Type (Thinning Equipment and Dicing Equipment), by Application (Memory and Logic Through Silicon Via (TSV), Micro Electro Mechanical Systems (MEMS) Devices, Power Devices, CMOS Image Sensors, and Radio Frequency Identification (RFID)), by Wafer Size(Less Than 4-inch, 5-inch and 6-inch, 8-inch, and 12-inch): Global Opportunity Analysis and Industry Forecast, 2021-2031" According to the report, the global thin wafer processing and dicing equipment industry generated $643.78 million in 2021, and is estimated to reach $1.2 billion by 2031, witnessing a CAGR of 6.7% from 2022 to 2031. The report offers a detailed analysis of changing market trends, top segments, key investment pockets, value chains, regional landscapes, and competitive scenarios.  Download Free Sample Report@ https://www.alliedmarketresearch.com/request-sample/15070 Drivers, Restraints, and Opportunities Developments in semiconductor technology, growing demand for high-performance integrated circuits and developments in semiconductor technology, and the increasing adoption of Radio Frequency Identification (RFID) tags drive the growth of the global thin wafer processing and dicing equipment market. On the other hand, the high cost associated with the manufacturing process restrains growth to some extent. However, the wafers' high-quality flat surface is the primary reason for their increasing integration into processing. Investments in wafer enhancement have paved the way for lucrative opportunities in the industry. Covid-19 Scenario
The Dicing Equipment Segment to Maintain its Dominance During the Forecast Period By equipment type, the dicing equipment segment garnered the highest share in 2021, holding nearly three-fifths of the global thin wafer processing and dicing equipment market revenue. This is because during dicing the round wafers are typically mounted on dicing tape to ensure the fixed position of the wafer on the very thin metal sheet frame. The task of the wafer dicing machines is to cut wafers into individual semiconductor chips with blades. Automated dicing tools are ideal for use in production environments where large numbers of wafers are processed and wafer and die dimensions are constant. During R&D and when only small batches of chips are required, it is beneficial to have a clean, accurate, repeatable, and fast tool to dice wafers. The 5-inch and 6-inch Segment to Dominate by 2031 By wafer size, the 5-inch and 6-inch segment accounted for nearly two-thirds of the global thin wafer processing and dicing equipment market share in 2021, and is projected to retain its domnance by 2031. Wafer size, which refers to a wafer's diameter, is a crucial factor in the process of making semiconductors. In high-volume manufacturing, a bigger wafer size allows for the fabrication of more dies per wafer, which lowers costs. Interested to Procure the Data? Inquire Here (Get Full Insights in PDF - 19 Pages) @ https://www.alliedmarketresearch.com/purchase-enquiry/15070 The Memory and Logic segment to Rule the Roost By application, the memory and logic segment accounted for more than three-fifths of the global thin wafer processing and dicing equipment market revenue in 2021, and is projected to retain the lion's share by 2031. This is due to the widespread adoption of low-cost cloud computing solutions, there is a significant increase in the implementation of server and data center systems across a variety of businesses and industries, which in turn drives the demand for logic devices like microprocessors and digital signal processors. Thinning technology is preferred in logic devices to enable high-speed processing and reconfigurations. Thin wafers are being utilized in these devices more frequently to guarantee effective heat control and maximize performance, which helps to fuel the expansion of the thin wafer market for logic devices. Asia-Pacific Garnered the Major Share in 2021 By region, Asia-Pacific contributed to the highest share in 2021, garnering more than one-third of the global thin wafer processing and dicing equipment market revenue. Asia Pacific is the largest and fastest-growing semiconductor market in the world. Significant demand for smartphones and other consumer electronics devices from China, the Republic of Korea, and Singapore is prompting many vendors to set up manufacturing facilities in the region. In the case of India, the recent increase in customs duties on imported electronics is a major factor in attracting Apple and other multinational corporations to establish manufacturing facilities there. More than 90% of the foundries built worldwide in 2017 were located in the Asia-Pacific region, as stated by the SEMI, a prominent global association serving the electronics manufacturing supply chain. Enquire for Customization with Detailed Analysis of COVID-19 Impact in Report @ https://www.alliedmarketresearch.com/request-for-customization/15070 Leading Market Players
The report analyzes these key players in the global thin wafer processing and dicing equipment market. These players have adopted various strategies such as expansion, new product launches, partnerships, and others to increase their market penetration and strengthen their position in the industry. The report is helpful in determining the business performance, operating segments, developments, and product portfolios of every market player. Key Benefits For Stakeholders:
Thin Wafer Processing and Dicing Equipment Market Key Segments: Equipment Type
Wafer Thickness
Wafer Size
Application
Dicing Technology
Buy this Research Report @ https://bit.ly/3DGScNa Trending Reports in Semiconductor Industry (Book Now with 10% Discount): Semiconductor Packaging Market Trends, Analytics and Statistics Wafer Level Packaging Market Manufacturer, Report to 2031 Fan-Out Wafer Level Packaging Market Size, Share | Industry Trends Embedded Die Packaging Technology Market Insight and Trends 2031 Bonding Wire Packaging Market Size, Share | 2023 - 2031 About Us Allied Market Research (AMR) is a full-service market research and business-consulting wing of Allied Analytics LLP based in Portland, Oregon. Allied Market Research provides global enterprises as well as medium and small businesses with unmatched quality of 'Market Research Reports' and 'Business Intelligence Solutions'. AMR has a targeted view to provide business insights and consulting to assist its clients to make strategic business decisions and achieve sustainable growth in their respective market domain. We are in professional corporate relations with various companies and this helps us in digging out market data that helps us generate accurate research data tables and confirms utmost accuracy in our market forecasting. Allied Market Research CEO Pawan Kumar is instrumental in inspiring and encouraging everyone associated with the company to maintain high quality of data and help clients in every way possible to achieve success. Each and every data presented in the reports published by us is extracted through primary interviews with top officials from leading companies of domain concerned. Our secondary data procurement methodology includes deep online and offline research and discussion with knowledgeable professionals and analysts in the industry. Contact: Logo: https://mma.prnewswire.com/media/636519/Allied_Market_Research_Logo.jpg
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