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SMIC branch signs agreement for 2 phase construction project in Beijing
[May 15, 2012]

SMIC branch signs agreement for 2 phase construction project in Beijing

BEIJING, May 15, 2012 (Xinhua via COMTEX) -- SMIC Integrated Circuit Produ ction (Beijing), the Beijing Municipal Commission of Economy and Infor mation Technology, and the Administrative Committee Beijing Economic-T echnological Development Area signed a cooperative framework agreement here on Tuesday to jointly invest in the construction of SMIC Beijing 's second-phase project.

The second phase project will involve the construction of new manufacturing buildings in the existing plant and introducing new equipment for product manufacture using 45/40 nm and 32/28 nm technol ogy.

The project is expected to provide an advanced platform t o test the findings of the research in terms of large-scale integrated circuit manufacturing technology, as well as key equipment and materi al. It will also help IC companies developing high-end chip products u sed in CPU, memory, mobile communication, digital video, and audio equ ipment, and facilitate the large-scale development of Beijing's next-g eneration Internet, cloud computing, the Internet of Things and other emerging industries of strategic importance.

SMIC Beijing is a subsidiary of the China-based Semiconductor M anufacturing International Corp. (SMIC, SMI.NYSE; 00981.HK). (Edited b y Luo Jingjing,

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