[September 11, 2017] |
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Kulicke & Soffa to Participate at SEMICON Taiwan 2017
Kulicke & Soffa Industries (News - Alert), Inc. (NASDAQ: KLIC) ("Kulicke & Soffa",
"K&S" or the "Company"), announced today that it will be exhibiting at
the SEMICON Taiwan trade show in Taipei, September 13 through September
15, 2017.
Kulicke & Soffa will introduce its upcoming GEN-S Series of ball bonding
solutions and will also showcase several other leading solutions serving
the growing Automotive, Industrial and Advanced Packaging markets.
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RAPIDTM Pro - the first in the new
GEN-S (Smart Generation) Series of high performance ball bonders. RAPIDTM
Pro introduces advanced process capabilities, real-time monitoring and
diagnostics to ensuring the highest quality and efficient assembly
serving automotive applications in addition to high-performance,
high-reliability semiconductor applications.
"Our latest
GEN-S series highlights our continuous focus on research and
development to deliver value-added solutions with unparalleled
performance to our customers," stated Nelson Wong, Kulicke & Soffa's
Vice President of Ball Bonder Business Line & Strategic Solutions
Development.
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AsterionTM - enhanced capabilit hybrid wedge
bonder. It offers an expanded bond area with robust pattern
recognition capabilities and extremely tight process controls for
advanced interconnect materials.
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ATPremierTM PLUS - the versatile wafer
level bonder with the smallest footprint that delivers superior
wafer-level stud bumping and high productivity with increased
efficiency.
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Hybrid with Horizontal Wafer Feeder - an innovative solution
that enables the combination of ultra-high-speed passive and active
placement with high-accuracy flip-chip bonding directly from wafer,
ideal for high-volume System-in-Package (SiP), flip-chip, die-attach
and wafer-level-package manufacturing. Placement accuracy up to 7µm @
3 sigma, provides a compelling alternative to existing commercial
solutions.
The Company will be demonstrating these products at booth number 540 on
level 4 of the Taipei Nangang Exhibition Center.
About Kulicke & Soffa
Kulicke & Soffa (NASDAQ:KLIC) is a leading provider of semiconductor
packaging and electronic assembly solutions supporting the global
automotive, consumer, communications, computing and industrial segments.
As a pioneer in the semiconductor space, K&S has provided customers with
market leading packaging solutions for decades. In recent years, K&S has
expanded its product offerings through strategic acquisitions and
organic development, adding advanced packaging, electronics assembly,
wedge bonding and a broader range of expendable tools to its core
offerings. Combined with its extensive expertise in process technology
and focus on development, K&S is well positioned to help customers meet
the challenges of packaging and assembling the next-generation of
electronic devices. (www.kns.com)
View source version on businesswire.com: http://www.businesswire.com/news/home/20170911005186/en/
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