ColorChip and MaxLinear announce Chip-on-Board AEC Technology enabling 800G and 1.6Tbps Applications
YOKNEAM, Israel , March 1, 2023 /PRNewswire/ -- ColorChip Ltd. today announces the innovative chip-on-board technology for active electrical cables, enabling the highest density 1.6T OSFP-XD with significant improvements in both performance and cost. This innovation addresses the challenges of density, reach, power consumption and higher bandwidth required for the new OSFP-XD form factor and can also be leveraged to produce best-in-class solutions for 800G AEC applications.
With datacenters and carriers/MSO's rapidly migrating to 800Gbps and 1.6Tbps capability, a cost effective and reliable active copper solution is required. ColorChip is leading the market with these innovative and cutting edge capabilities. By removing the lossy and bulky package of the Re-timer, DSP or Re-driver, this innovation enables a longer reach, better cost, better thermal management and higher density for active cpper cable solutions. Collaborating with Maxlinear, this is the first time in the industry that an active cable has been developed with a bare die.
"Partnering with ColorChip, we are bringing our companies' advanced technologies and capabilities together to provide our joint customers with industry leading solutions for AEC applications", said Drew Guckenberger, Vice President of High-Speed Interconnect BU at MaxLinear.
"MaxLinear's Keystone 5nm KGD bare die solutions for AEC applications enable the high density, long reach and best-in-class power consumption required to meet our customers' key requirements for 800G and 1.6T AEC applications," said Xin Wu, EVP at ColorChip.
For more information please visit us at www.color-chip.com
Media contact: Einav Bahat [email protected]
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SOURCE ColorChip Ltd.