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Qumulo Strengthens Leadership Team with New Senior Vice President of North America Sales
[February 21, 2024]

Qumulo Strengthens Leadership Team with New Senior Vice President of North America Sales


Today, Qumulo, the simple way to manage exabyte-scale data anywhere, announced the appointment of Brian McCloskey as Senior Vice President, North America Sales. McCloskey brings over 20 years of go-to-market experience to his new role, where he will drive the adoption of Qumulo's offerings across North America.

"Coming off a strong year that saw the launch of our Scale Anywhere™ technology and our recognition as a leader in the 2023 Gartner® Magic Quadrant™ for Distributed File Systems and Object Storage, we're excited to welcome Brian to our team," said Eric Brodersen, President and Chief Customer Officer at Qumulo. "His reputation for building high-performance teams aligns perfectly with our commitment to customer adotion and growth."



"I'm passionate about Qumulo's product portfolio and the value it can bring to the market," said McCloskey. "With our established on-premises offering serving over a thousand customers, and our newer cloud and global namespace offerings, we're uniquely positioned to help customers maximize the value of their unstructured data."

Prior to Qumulo, McCloskey was CRO at Fungible, where he led the field and marketing teams in building a sizable business in a new market segment. He also held a position at Pure Storage as Global VP at Unstructured Data Solutions. Additionally, McCloskey has held leadership positions at EMC, NetApp, and SolidFire.


About Qumulo, Inc.

Qumulo delivers the world's first unified Scale AnywhereTM platform for the hybrid enterprise. Qumulo is a 100% software solution that scales to exabytes anywhere unstructured data is created, consumed, stored, or managed so that businesses can operate a common platform, reducing CapEx and OpEx while moving ever faster.

Qumulo, Scale Anywhere and the Qumulo logo are registered trademarks or trademarks of Qumulo, Inc. All other marks and names herein may be trademarks of other companies. Copyright © 2023. All Rights Reserved.


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