TMCnet News

Global High-bandwidth Memory Market Analysis & Forecasts 2018-2022, With an Expected CAGR of 32.09% - ResearchAndMarkets.com
[August 03, 2018]

Global High-bandwidth Memory Market Analysis & Forecasts 2018-2022, With an Expected CAGR of 32.09% - ResearchAndMarkets.com


The "Global High-bandwidth Memory Market 2018-2022" report has been added to ResearchAndMarkets.com's offering.

The analysts forecast the global high-bandwidth memory market to grow at a CAGR of 32.09% during the period 2018-2022.

High-bandwidth memory (HBM) is a dynamic random-access memory (DRAM) technology approved by the Joint Electron Device Engineering Council (JEDEC) as an industry standard. The technology uses through-silicon vias (TSVs) and a silicon interposer technology to interconnect stacked DRAM dies.

The report covers the present scenario and the growth prospects of the global high-bandwidth memory market for 2018-2022. To calculate the market size, the report presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources.

One trend in the market is growth of AI. The development in neutral networks, deep learning, and AI algorithms has increased exponentially. The nuber of pilot programs and proof-of-concepts conducted by firms in the field of AI is increasing.



One driver in the market is increasing demand for HPC. HPC systems are used for tasks that cannot be resolved using conventional computing. With the increasing interest in big data, as well as the rapid increase in the number of data centers, we can expect an increase in the demand for HPC systems, as they are required to process large amounts of information.

The report states that one challenge in the market is exorbitant costs. HBM is highly expensive as compared with other interfaces such as GDDR5 and GDRR6. This is limiting its adoption in several sectors. For a GPU, the die and memory account for majority of the overall cost.


Companies Mentioned

  • Advanced Micro Devices (News - Alert)
  • Intel
  • SAMSUNG
  • SK HYNIX
  • XILINX

Key Topics Covered:

01. Executive Summary

02. Scope Of The Report

03. Research Methodology

04. Market Landscape

05. Market Sizing

06. Five Forces Analysis

07. Market Segmentation By Application

08. Market Segmentation By Product

09. Customer Landscape

10. Regional Landscape

11. Decision Framework

12. Drivers And Challenges

13. Market Trends

14. Vendor Landscape

15. Vendor Analysis

16. Appendix

For more information about this report visit https://www.researchandmarkets.com/research/6qqvb5/global?w=4


[ Back To TMCnet.com's Homepage ]