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Complete Teardown of Intel's RealSense D435 - An Intelligent USB-C Powered 3D Active Infra-Red Global Shutter Stereo Depth CameraDUBLIN, June 19, 2018 /PRNewswire/ -- The "Intel RealSense D435 3D Active IR Stereo Depth Camera Complete Teardown Report" report has been added to ResearchAndMarkets.com's offering.  Integrated in a compact aluminum case, the Intel RealSense D435 is an intelligent USB-C powered 3D active infra-red global shutter stereo depth camera. It combines a conventional red/green/blue (RGB) color sensor, a vertical-cavity surface-emitting laser (VCSEL) projector and left- and right-side imagers for stereo vision. The 3D camera has a minimum depth of 0.2m and can scan environments up to 10m wide with a resolution depth of up to 1280720 at 90 frames per second (fps). The system uses a 28nm Intel D4 vision processor for processing complex depth data in real time and a Realtek color image processor. The infrared laser projector is tiny, measuring only 2.7mm x 1.8mm, uses VCSEL technology and can record 60fps. Omnivision supplies the three image sensors; a CMOS 1080p RGB sensor and twin 1-megapixel sensors for the left and right side imagers. The components and sensors are contained in all grid array (BGA) and wafer level packaging, all mounted on two single-sided boards whose total surface area is less than 20cm. Based on a complete teardown analysis of the RealSense D435, the report provides high definition pictures of the vision processor, VCSEL IR projector and image sensor dies as well as the bill-of-material (BOM) and the manufacturing cost of the depth module. Key Topics Covered: 1. Intel Company Profile, Camera Main Features and Main Chipset
3. Cost Analysis
4. Estimation of the Selling Price - Intel For more information about this report visit https://www.researchandmarkets.com/research/jn423z/complete_teardown?w=5 Media Contact: Laura Wood, Senior Manager
SOURCE Research and Markets 
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