[May 14, 2018]

Global 3D TSV and 2.5D Market 2018-2023 - Segmented by Technology (DDR2, DDR3, and DDR4) and Application (Mobile Devices, Computing Devices, and Networking Devices) - ResearchAndMarkets.com

The "Global 3D TSV and 2.5D Market - Segmented by Technology (DDR2, DDR3, and DDR4), Application (Mobile Devices, Computing Devices, and Networking Devices), and Geography - Growth, Trends, and Forecast (2018 - 2023)" report has been added to ResearchAndMarkets.com's offering.

The global 3D TSV and 2.5D market is expected to project a growth rate of 35.2% during the forecast period 2018-2023. Shipments of smartphones is expected to reach 2 billion units by 2020, majorly due to the availability of low-cost smartphones in developing nations, such as China and India.

Key Developments in the Market

• March 2017 - Advanced Semiconductor (News - Alert) Engineering, Inc., and Cadence Design Systems, Inc., announced they have collaborated to release a System-in-Package (SiP) EDA solution, that addresses the challenges of designing and verifying Fan-Out Chip-on-Substrate (FOCoS) multi-die packages.

Drivers

• Expanding Market for Smartphones, Tablets, and Gaming Devices
• Rising Trend of Miniaturization of Electronics Devices

Restraints

• High Unit Cost of 3D IC and 2.5D IC Packages

Companies Mentioned

• Taiwan Semiconductor Manufacturing Company Limited
• Samsung Electronics Co. Ltd
• Toshiba (News - Alert) Corp.
• Pure Storage Inc.
• Advanced Semiconductor Engineering Inc.
• Amkor Technology
• United Microelectronics Corp.
• STMicroelectronics (News - Alert) NV
• Broadcom Ltd
• Intel Corporation
• Jiangsu Changing Electronics Technology Co. Ltd

Key Topics Covered

1. Introduction

2. Research Approach and Methodology

3. Executive Summary

4. Market Dynamics

5. Global 3D TSV and 2.5D IC Market - Segmentation

6. Competitive Intelligence - Company Profiles

7. Investment Analysis

8. Outlook of 3D TSV and 2.5D IC Market

For more information about this report visit https://www.researchandmarkets.com/research/f8nwgs/global_3d_tsv_and?w=4

View source version on businesswire.com: https://www.businesswire.com/news/home/20180514005950/en/

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