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TSMC Integrated Fan-Out (inFO) Packaging Complete Teardown Analysis 2018 with Comparisons of Standard PoP and Shinko's MCeP PoP PackagingDUBLIN, March 12, 2018 /PRNewswire/ -- The "TSMC's Integrated Fan-Out (inFO) Packaging for the Apple A11 found in the iPhone X Complete Teardown Report" report has been added to ResearchAndMarkets.com's offering. This report analyzes the complete package, from the DRAM memory to the LSC developed by TSMC. The report includes a comprehensive cost analysis and price estimation of the device based on detailed description of the packaging. It also features a detailed technology comparison with standard PoP and Shinko's MCeP PoP packaging. Until 2015, Apple used to integrate its application processor engine (APE) in standard Package-on-Package (PoP) packaging. Starting in 2016, with the Apple A10 APE in the Apple iPhone 7, TSMC has brought a breakthrough fan-out technology called integrated Fan-Out (inFO) packaging to the market. This is still the most innovative, powerful and cost-effective fan-out packaging technology for the APE. For its latest flagships, the Apple iPhone 8 and tenth's anniversary iPhone X, Apple has renewed its collaboration with TSMC by using the new generation of inFO packaging for the Apple A11 APE. The Apple A11 is a wafer-level package using the new generation of TSMC's packaging technology. It uses copper pillars, called Through inFO Vias (TiVs), to replace the well-known Through Molded Via (TMV) technology. Apple still outperforms standard PoP technology thanks to the inFO packaging and its innovations, which include copper pillars, redistribution layers and silicon high density capacitor integration. Key Topics Covered: 1. Overview/Introduction Companies Mentioned
For more information about this report visit https://www.researchandmarkets.com/research/ndlr8j/tsmc_integrated?w=5 Media Contact: Research and Markets View original content:http://www.prnewswire.com/news-releases/tsmc-integrated-fan-out-info-packaging-complete-teardown-analysis-2018-with-comparisons-of-standard-pop-and-shinkos-mcep-pop-packaging-300612173.html SOURCE Research and Markets |