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Advanced Semiconductor Packaging Market, Fan-In Wafer-Level Packaging, Flip Chip, 2.5D/3D; Application; End User; - Global Industry Analysis, Size, Share, Growth, Trends and Forecast 2017 - 2026LONDON, Fev. 6, 2018 /PRNewswire/ -- Global Advanced Semiconductor Packaging Market- Overview The report also offers segment-wise analysis and region-wise analysis of the global advanced semiconductor packaging market. The secondary research was done to gather data on the market. Sources used in the secondary research included investor presentations, annual reports and financial reports of the major companies. Absolute dollar opportunity is also provided in the report to identify various market opportunities. The report comprises vital information on the key companies operating in the global advanced semiconductor packaging market. The report enlightens on the key business strategies, developments, new product launch by the key market players. The report also includes details on the regulations in the market across the globe. The report also focuses on the technological advancements in the market and how new technologies will impact the growth of the market in future. Global Advanced Semiconductor Packaging Market- Segmentation The global advanced semiconductor packaging market is segmented based on packaging type, application, end user, and region. On the basis of packaging type, the advanced semiconductor packaging market is divided into Fan-Out Wafer-Level Packaging (FO WLP), Fan-In Wafer-Level Packaging (FI WLP), Flip Chip (FC), and 2.5D/3D. On the basis of application, the market is divided into application processor/ baseband, central processing units/graphical processing units, dynamic random access memory, NAND, image sensor, and other applications. Based on the end user, the market is divided into telecommunications, automotive, aerospace and defense, medical devices, consumer electronics, and other end users. Region-wise the global market for advanced semiconductor packaging is segmented into Japan, Asia Pacific Excluding Japan (APEJ), Europe, North America, Latin America, and the Middle East and Africa (MEA). Competitive Landscape Some of the key players in the global advanced semiconductor packaging market are Intel Corp, AMD, Amkor Technology, Hitachi Chemical, STMicroelectronics, Infineon, Sumitomo Chemical Co. Ltd., Avery Dennison, Kyocera, and ASE Group. Download the full report: https://www.reportbuyer.com/product/5309069 About Reportbuyer Reportbuyer is a leading industry intelligence solution that provides all market research reports from top publishers For more information: Sarah Smith Research Advisor at Reportbuyer.com Email: [email protected] Tel: +1 (718) 213 4904 Website: www.reportbuyer.com SOURCE ReportBuyer |