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Global 3D Semiconductor Packaging Market Forecasts to 2023 - Research and MarketsThe "Global 3D Semiconductor Packaging Market Research Report Insights, Opportunity Analysis, Market Shares and Forecast 2017 - 2023" report has been added to Research and Markets' offering. The market is majorly driven by the rising trend of miniaturization of electronics devices. Need for designing cost effective chips plays a major role in overall price of electronic devices. However, thermal issues in devices due to high level integration and high unit cost of 3d packaging are restraining the growth of market. Global 3D semiconductor market is growing steadily with the increase in the sales of microelectronics and consumer electronic. With the advancement in the consumer electronics sector as the emergence of 3D TVs and ultra-high definition TVs and hybrid laptops the demand for semiconductor ICs will increase. Market Drivers
Market Restraints ul>Market Opportunities
Market Challenges
The overall demand for 3D semiconductor packaging has been exceptionally high in Asia Pacific. This region in terms of growth is expected to lead the market forecast period. Followed by North America and Europe, which continue their constant increase in demand for 3D semiconductor packaging as the market in both regions is considered mature. A great deal of manufacturers holds capacities in Asia Pacific, which makes it leading region in the market currently. Key Topics Covered: 1. Introduction 2. Market Overview 3. Market Determinants 4. Market Segmentation 5. Competitive Landscape 6. Geographic Analysis 7. Company Profiles
For more information about this report visit https://www.researchandmarkets.com/research/lnrwtc/global_3d View source version on businesswire.com: http://www.businesswire.com/news/home/20171206005513/en/ |