[November 13, 2017] |
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Rudolph Technologies to Participate in the Sixth Annual NYC Investor Summit 2017
Rudolph Technologies (NYSE: RTEC), today announced that company
management is scheduled to participate in the 6th Annual NYC Investor
Summit 2017, being held December 6, 2017 at the Le Parker Méridien
Hotel, New York, NY.
The presentation material utilized during the conference will be made
accessible on the investor page of Company's website at www.rudolphtech.com.
About the NYC Investor Summit The NYC Investor Summit is
hosted by executive management from participating companies and will
feature a "round-robin" format consisting of small group meetings, each
30 minutes in duration. During the event, investors and analysts will
have the opportunity to meet with up to 10 of the 14 management teams
during the 30-minute group meeting sessions, as well as opportunities to
meet with additional management teams during the breakfast and lunch
networking sessions.
The 14 management teams collectively hosting the 2017 NYC Investor
Summit include: Aehr (News - Alert) Test (AEHR), Axcelis (ACLS), BE Semiconuctor
Industries (BESI.AS), Brooks (BRKS), Camtek (CAMT), Cohu (COHU), Electro
Scientific (ESIO), FormFactor (FORM), Ichor Systems (ICHR), inTEST
(INTT), Intevac (News - Alert) (IVAC), Kulicke & Soffa (KLIC), Nanometrics (NANO), and
Rudolph Technologies (RTEC). Sponsoring the networking luncheon is Cowen
& Co.
The NYC Investor Summit is by invitation only and is open to accredited
investors and publishing research analysts. As space is limited, please
RSVP early. Hosts reserve the right to limit attendance as necessary.
Last day for registration is November 27, 2017.
RSVP Contacts for the 6th Annual NYC
Investor Summit 2017 To RSVP for the NYC Investor Summit,
please contact either of the Summit's co-chairs.
Laura J. Guerrant-Oiye Guerrant Associates Phone (News - Alert): (808)
960-2642 Email: [email protected]
Claire E. McAdams Headgate Partners LLC Phone: (530) 265-9899 Email:
[email protected]
About Rudolph Technologies Rudolph Technologies, Inc. is a
leader in the design, development, manufacture and support of defect
inspection, lithography, process control metrology, and process control
software used by semiconductor and advanced packaging device
manufacturers worldwide. Rudolph delivers comprehensive solutions
throughout the fab with its families of proprietary products that
provide critical yield-enhancing information, enabling microelectronic
device manufacturers to drive down costs and time to market of their
devices. Headquartered in Wilmington, Massachusetts, Rudolph supports
its customers with a worldwide sales and service organization.
Additional information can be found on the Company's website at www.rudolphtech.com.
View source version on businesswire.com: http://www.businesswire.com/news/home/20171113006186/en/
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