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Media Alert: Rambus to Demonstrate High-Performance IP Cores for Networking and Data Center at TSMC OIP Ecosystem ForumRambus (News - Alert) Inc. (NASDAQ:RMBS):
Rambus will be demonstrating its high-speed SerDes IP Cores at the TSMC Open Innovation Platform (OIP) Ecosystem forum this week in Santa Clara, Calif. Additional details Rambus Multi-protocol SerDes PHY
Visit Rambus at Booth 916 to learn more. About Rambus Memory and Interfaces Division The Rambus Memory and Interfaces Division develops products and services that solve the power, performance, and capacity challenges of the communications and data center computing markets. Rambus enhanced standards-compatible and custom memory and serial link solutions include chips, architectures, memory and SerDes interfaces, IP validation tools, and system and IC design services. Developed through our system-aware design methodology, Rambus products deliver improved time-to-market and first-time-right quality. About Rambus Inc. Rambus creates innovative hardware and software technologies, driving advancements from the data center to the mobile edge. Our chips, customizable IP cores, architecture licenses, tools, software, services, training and innovations improve the competitive advantage of our customers. We collaborate with the industry, partnering with leading ASIC and SoC designers, foundries, IP developers, EDA companies and validation labs. Our products are integrated into tens of billions of devices and systems, powering and securing diverse applications, including Big Data, Internet of Things (IoT), mobile payments, and smart ticketing. At Rambus, we are makers of better. For more information, visit rambus.com. View source version on businesswire.com: http://www.businesswire.com/news/home/20170912005702/en/ |