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Global Semiconductor Advanced Packaging Market 2017-2021 - Key Vendors are ASE, Amkor Technology, Samsung & TSMC - Research and MarketsThe "Global Semiconductor Advanced Packaging Market 2017-2021" report has been added to Research and Markets' offering. The global semiconductor advanced packaging market to grow at a CAGR of 8.45% during the period 2017-2021 The report covers the present scenario and the growth prospects of the global semiconductor advanced packaging market for 2017-2021. To calculate the market size, the report considers the sale of semiconductor capital equipment to end-use segments. The report also includes a discussion of the key vendors operating in this market. The latest trend gaining momentum in the market is Changes in wafer size. The semiconductor industry has seen a drastic transition in wafer size over the last five decades (1910-2016). The industry is focusing on producing larger diameter wafers, which is expected to cut down the manufacturing cost by 20%-25%. According to the report, one of the major drivers for this market is Complex semiconductor IC designs. The number of features and functionalities offered by consumer electronic devices is on the rise as electronic device manufacturers look to differentiate their oferings from those of competitors. Further, the report states that one of the major factors hindering the growth of this market is Rapid technological changes. The rapid technological advancements in wafer processing have always been a major challenge faced by vendors in the semiconductor advanced packaging market. The semiconductor industry is continuously seeing transitions, such as the miniaturization of nodes and the increase in wafer sizes with respect to ultra-large-scale integration (ULSI) fabrication technology. Key Vendors
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Key Topics Covered: Part 01: Executive Summary Part 02: Scope Of The Report Part 03: Research Methodology Part 04: Introduction Part 05: Technology Landscape Part 06: Market Landscape Part 07: Segmentation By Packaging Technology Part 08: Segmentation By Device Type Part 09: Geographical Segmentation Part 10: Decision Framework Part 11: Drivers And Challenges Part 12: Market Trends Part 13: Vendor Landscape Part 14: Appendix For more information about this report visit https://www.researchandmarkets.com/research/l7gbbr/global View source version on businesswire.com: http://www.businesswire.com/news/home/20170814005411/en/ |