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Toshiba Leads Sessions and Demos on New Advances in Memory, SSD and Architecture Technologies at Flash Memory Summit
SANTA CLARA, Calif., Aug. 7, 2017 /PRNewswire/ --
WHAT: Flash Memory Summit 2017
WHEN: August 8-10, 2017
WHERE: Santa Clara Convention Center in Santa Clara, CA
WHO:
Toshiba America Electronic Components, Inc. (TAEC) will demonstrate groundbreaking memory and storage technologies in several different applications in booth #407 at the Flash Memory Summit (FMS) this week. Toshiba employees will also be featured presenters on various technologies and topics around SSDs, new flash technologies and applications. Demonstrations and theater presentations will take place in Toshiba's two-level booth (#407) on the show floor at the Santa Clara Convention Center from August 8-10.
Featured Keynote Presentation
TITLE: "Flash Memory is Going Places We Have Never Been Before"
SPEAKERS: Steve Fingerhut, senior vice president and general manager of storage products and Shigeo (Jeff) Ohshima, technology executive, SSD application engineering
DATE: Tuesday, August 8th
TIME: 12:10 - 12:40 p.m.
Sessions and Panels
Toshiba was selected by FMS organizers to present in the following sessions and panels:
TITLE: "Avoiding Costly I/O Latency Variations in SSDs Through I/O Determinism" (Forum B-11)
SPEAKER: Steven Wells, Toshiba fellow, data center architecture
DATE: Tuesday, August 8th
TIME: 8:30 - 10:50 a.m.
TITLE: "NVM Express® (NVMeTM1) BGA: NVMe in a Small Form Factor" (101-A)
SPEAKER: Balaji Venkateshwaran, director of strategic marketing
DATE: Tuesday, August 8th
TIME: 8:30 - 9:35 a.m.
TITLE: "Ballooning Demand for NAND in Autonomous Vehicles Beyond 2020" (Invited talk T-11)
SPEAKER: Hrishi Sathawane, senior staff storage engineer/analyst
DATE: Tuesday, August 8th
TIME: 8:30 - 10:50 a.m.
TITLE: "TCG3 + NVMe Security" (Forum A-11)
SPEAKER: Jeremy Werner, vice president, marketing and product planning
DATE: Tuesday, August 8th
TIME: 10:30 - 10:50 a.m.
TITLE: "Achieving Optimized, Dynamic Storage Provisioning with NVMe-oF™ (NVM Express™ over Fabrics)1" (Forum C-12)
SPEAKER: Joel Dedrick, systems architect, NVMe-oF
DATE: Tuesday, August 8th
TIME: 3:40 - 6:00 p.m.
TITLE: "Device Architectures to Best Enable PCIe®2 Gen 4" (Forum B-12)
SPEAKER: Rob Sykes, distinguished engineer
DATE: Tuesday, August 8th
TIME: 3:40 - 6:00 p.m.
TITLE: "NVMe SSD with Persistent Memory Region" (Forum M-31)
SPEAKER: Chander Chadha, senior technical product engineer
DATE: Wednesday, August 9th
TIME: 8:30 - 9:45 a.m.
TITLE: "Emerging Solutions for Persistent Memory" (Session X-103)
SPEAKER: Tom Friend, Director of Industry Standards
DATE: Wednesday, August 9th
TIME: 3:00 - 3:50 p.m.
TITLE: "All Flash Edge Computing Platform for IoT" (Forum W-32)
SPEAKER: Ram Johri, system architect
DATE: Thursday, August 10th
TIME: 9:45 - 10:50 a.m.
TITLE: "Flash-Based Edge Computing System for IoT" (Invited Talk IT-10)
SPEAKER: Atsuhiro Kinoshita, Flashmatrix project lead
DATE: Thursday, August 10th
TIME: 1:30 - 3:40 p.m.
Toshiba will also be leading sessions and forums on many technology and application topics.
TITLE: Consumer Applications: Session 101-A
SPEAKER: John Geldman, director, SSD industry standards
DATE: Tuesday, August 8th
TIME: 8:30 - 9:35 a.m.
TITLE: Enterprise Storage: Forum D-12
SPEAKER: Steve Garceau, senior product marketing manager, enterprise SSDs
DATE: Tuesday, August 8th
TIME: 3:40 - 6:05 p.m.
TITLE: PCIe-NVMe Issues: Forum A-21
SPEAKER: Maulik Sompura, director of product management, data center and client SSDs
DATE: Wednesday, August 9th
TIME: 8:30 - 10:50 a.m.
TITLE: Flash Storage: Session 202-B: "The Performance Story: An Independent Evaluation of Flash Storage"
SPEAKER: John Geldman, director, SSD industry standards
DATE: Wednesday, August 9th
TIME: 9:45 - 10:50 a.m.
TITLE: Flash and Big Data: Session 204-C: "Flash in Big Data Applications"
SPEAKER: Mark Carlson, principal engineer, industry standards
DATE: Wednesday, August 9th
TIME: 4:40 - 5:45 p.m.
TITLE: Application Acceleration: Session 303-C
SPEAKER: Aaron Behman, senior director of marketing, FlashmatrixTM 4
DATE: Thursday, August 10th
TIME: 1:30 - 2:45 p.m.
TITLE: Flash and IoT: Session 304-A: "Flash and the Internet of Things"
SPEAKER: Nidish Kamath, architect, enterprise SSDs
DATE: Thursday, August 10th
TIME: 3:00 - 4:15 p.m.
Toshiba Booth (#407) Demos
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Demo
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Description
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Client SSDs: BG and XG Series
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The new ultra-mobile, single package BG3 NVMe Client SSD using HMB (Host Memory Buffer) will be demonstrated live. Toshiba's high-performance XG5 M.2 NVMe Client SSD will also be on display.
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Enterprise NVMe SSDs: CM5 Series
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The most comprehensive, feature-rich NVMe SSD available, Toshiba's CM5 is the first5 enterprise SSD with 3D TLC flash.
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NVMe over Fabrics
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A technology demonstration that validates NVMe-oF's ability to provide DAS-like performance as local NVMe, over the network, in demonstrations with Lenovo and Mellanox.
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Enterprise SAS SSDs: PM5 Series
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The fastest6 SAS SSD 12Gbit/s SAS series available for enterprise server and storage systems, built on 3D TLC flash.
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Enterprise SATA SSDs: HK Series
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Optimized for high performance and low power in data center applications, Toshiba's HK Series has been put through independent third-party testing by Storage Review – and it emerged the clear leader among competitors.
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IO Determinism
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Lightning systems will demonstrate IO Determinism (IOD). QoS latency improvements will be shown through firmware enhancements using the theory of IOD on a standard Toshiba NVMe PCIe drive.
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Client SSD OEM Solutions
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A showcase of mobile computing products that utilize Toshiba's cSSDs.
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cSSD, eSSD and Memory Product Samples
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Toshiba's broad lineup of flash solutions will be available to view at the reception desk.
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FlashMatrix 1000
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Toshiba's 'superconverged' edge and analytics platform will be shown running Red Hat®7 Enterprise Linux®8 (RHEL®), on 24 processors, with all 24 processors able to read and write from and to the entire 24TB memory space.
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Through Silicon Via (TSV) Technology
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Performance comparison between BiCS FLASH and BiCS FLASH TSV. Demonstrates significant improvement in sequential write performance using TSV technology.
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BiCS FLASH™ 3D Flash Memory
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Holographic image showing structure of the industry's first9 96-layer 3D flash memory enabling a 1TB single package.
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NOTES
1: NVMe-oF and NVMe are trademarks of NVM Express, Inc.
2: PCI Express and PCIe are trademarks or registered trademarks of PCI-SIG
3: TCG: Trusted Computing Group
4: Flashmatrix is a trademark of Toshiba Memory Corporation
5: As of August 7, 2017, based on industry-published specifications
6: As of August 7, 2017, based on industry-published specifications in comparison to PM5 SAS SSD with 3,350 MB/s of sequential read and 2,720 MB/s of sequential write in MultiLink mode and 400,000 random read IOPS in narrow or MultiLink mode. Read and write speed may vary depending on the host device, read and write conditions, and file size
7: Red Hat and RHEL are registered trademarks of Red Hat, Inc.
8: Linux is a Registered Trademark of Linus Torvalds
9: As of February 22, 2017. Toshiba survey
*About Toshiba and Toshiba America Electronic Components, Inc. (TAEC)
Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), discrete devices, custom SoCs/ASICs, imaging products, microcontrollers, wireless components, mobile peripheral devices, advanced materials and medical tubes that make possible today's leading smartphones, tablets, cameras, medical devices, automotive electronics, industrial applications, enterprise solutions and more.
Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc. For over 140 years, Toshiba Corporation has contributed to a sustainable future by applying innovative technologies to value creation. Today, our business domains are centered on the essential infrastructure that supports modern life and society. Guided by the principles of The Basic Commitment of the Toshiba Group, "Committed to People, Committed to the Future", Toshiba promotes global operations that contribute to realization of a world where generations to come can live better lives.
To find out more about Toshiba, visit www.toshiba.co.jp/worldwide/about/index.html
©2017 Toshiba America Electronic Components, Inc. All rights reserved. Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications.
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MEDIA CONTACT:
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COMPANY CONTACT:
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Dena Jacobson
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Rebecca Bueno
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Lages & Associates
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Toshiba America Electronic Components, Inc.
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Tel.: (949) 453-8080
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Tel.: (949) 462-7885
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[email protected]
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[email protected]
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SOURCE Toshiba America Electronic Components, Inc.
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