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Global Fan-out Wafer Level Packaging Market 2017-2021 - Key vendors are Stats ChipPAC, TSMC & Texas Instruments - Research and Markets

[July 03, 2017]

Global Fan-out Wafer Level Packaging Market 2017-2021 - Key vendors are Stats ChipPAC, TSMC & Texas Instruments - Research and Markets

Research and Markets has announced the addition of the "Global Fan-out Wafer Level Packaging Market 2017-2021" report to their offering.

The analysts forecast the global fan-out wafer level packaging market to grow at a CAGR of 47.76% during the period 2017-2021.

Global Fan-Out Wafer Level Packaging Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

One trend in market is high adoption of semiconductor ICs in automobiles. The automation and electrification of automobiles have increased the need for semiconductor wafers. Several types of semiconductor ICs are used in automotive products such as GPS, airbag control, anti-lock braking system (ABS (News - Alert)), power doors and windows, car navigation and display, infotainment, collision detection technology, and automted driving. This will push the demand for WLP solutions for IC packaging used in the automobile segment.

One driver in market is growing application of semiconductor ICs in IoT. IoT is one of the fastest growing markets in the world, and more than 30 billion devices are estimated to be connected through the IoT by 2020, generating a total of about 52 trillion GBs of data. The devices connected through the IoT use sensors and actuators to collect and transmit data to a centralized location on a real-time basis. As this empowers the user to take an informed decision, the adoption of the IoT is increasing in several market segments, such as the consumer electronics, automotive, and medical.

Key vendors