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Toshiba Adds Dual-Sided Cooling to Power MOSFETs for Motor Control, Power Supplies
IRVINE, Calif., June 22, 2017 /PRNewswire/ -- Toshiba America Electronic Components, Inc. (TAEC)* has extended its range of high-efficiency U-MOS IX-H MOSFETs. The new 60V TPW1R306PL is an N-channel device in a DSOP Advance surface mount device (SMD) package that offers dual-sided cooling. The enhanced thermal dissipation provided by dual-sided cooling can help to reduce device count and save space in applications with high component density, including: DC-DC converters, secondary-side circuits of AC-DC power supplies and motor drives in cordless home appliances and power tools. The TPW1R306PL has an ultra-low typical on-resistance (@VGS =10V) of just 0.95mO and is offered in a very small form factor of 5x6mm. Maximum drain current and power dissipation are 100A and 170W, respectively. Additionally, the TPW1R306PL's top-of-package thermal resistance rating (Rth (ch-c) of 0.88k/W) is very low. Toshiba's U-MOS IX-H process enables an exceptional performance trade-off between RDS(ON) and output capacitance/output charge, making typical QOSS just 77.5nC (@VDS=30V, f=1MHz). This allows designers to further improve system performance and efficiency by raising switching speeds and reducing switching losses. Specifications
Pricing and Availability *About TAEC Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor, solid state drive and hard disk drive manufacturer and the world's seventh largest semiconductor manufacturer (Gartner, 2015 Worldwide Semiconductor Revenue, January, 2016). Founded in Tokyo in 1875, Toshiba is at the heart of a global network of over 550 consolidated companies employing over 188,000 people worldwide (as of March 31, 2016). Visit Toshiba's web site at http://toshiba.semicon-storage.com. Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. MEDIA CONTACT:
To view the original version on PR Newswire, visit:http://www.prnewswire.com/news-releases/toshiba-adds-dual-sided-cooling-to-power-mosfets-for-motor-control-power-supplies-300478007.html SOURCE Toshiba America Electronic Components, Inc. (TAEC) |