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Interposer and Fan-Out WLP Market - Entered the Growth Phase & is Expected to be Valued at $13.42 Billion in 2022 - Research and Markets

[April 26, 2017]

Interposer and Fan-Out WLP Market - Entered the Growth Phase & is Expected to be Valued at $13.42 Billion in 2022 - Research and Markets

Research and Markets has announced the addition of the "Interposer and Fan-Out WLP Market - Global Forecast to 2022" report to their offering.

The interposer and fan-out WLP market has entered the growth phase and is expected to be valued at USD 13.42 billion in 2022, growing at a CAGR of 28.09% between 2016 and 2022. The major factors driving the growth of the market include rising trend of miniaturization of electronics devices; increasing demand for advanced architecture in smartphones, tablets, and gaming devices; and increased usage of interposers and fan-out wafer level packaging (FOWLP) technology in MEMS and sensors. The main restraint for this market is the thermal-related issues caused by higher level of integration.

The market for through-silicon vias (TSVs) is expected to grow at a high rate between 2016 and 2022. The major factors driving the growth of the interposer and fan-out WLP market for TSVs include high interconnect density and space efficiencies. Also, the compact structure of TSVs has led to the increase in its demad for use in various smart technologies, including wearable and connected devices.

The demand for interposer and fan-out WLP for use in imaging and optoelectronics is growing as chip-scaled opto-electronic packaging is a cost- and size-effective packaging for image sensors. The increasing need for miniaturization and integration of optical and electronic components used in automotive imaging applications is generating huge demand for interposers and FOWLP, which offers high-performance packaging and occupies less space.

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