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Foxconn Interconnect Technology, Ltd. to Showcase QSFP-DD Solutions at OFC 2017SAN JOSE, Calif., March 20, 2017 /PRNewswire/ -- Foxconn Interconnect Technology, Limited ("FIT"), a leading supplier of interconnect solutions and a founder-promoter of the QSFP-DD MSA, will showcase its latest QSFP-DD solutions in featured product and technology demonstrations at the Optical Fiber Communications (OFC) Conference & Exhibition, to be held March 21-23, 2017, at the Los Angeles, CA Convention Center. The live traffic demonstrations will incorporate a selection of FIT's rapidly expanding QSFP-DD product portfolio that currently includes various configurations of cages, connectors and cables that combine to deliver 200 Gbps and 400 Gbps solutions. Conference attendees are invited to visit FIT at booth #2666 in the OFC corporate village at the Los Angeles Convention Center where the QSFP-DD products and demonstrations will be on display.
"As a founder-promoter of the QSFP-DD MSA, FIT is committed to the development of 50G, 200G and 400G products and technologies that will add to one of the broadest portfolios of transceivers, cages/connectors, direct attach copper (DAC), and active optical cables (AOC) on the market. The QSFP-DD product and technology showcases that will take place at this year's OFC demonstrate both our commitment to the MSA and our position as a market and technology leader," said Steve Shultis, Director of Product Marketing at Foxconn Interconnect Technology. Availability Additional FIT solutions to be showcased at booth #2666 include:
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To view the original version on PR Newswire, visit:http://www.prnewswire.com/news-releases/foxconn-interconnect-technology-ltd-to-showcase-qsfp-dd-solutions-at-ofc-2017-300425580.html SOURCE Foxconn Interconnect Technology, Ltd. |