[January 27, 2017]

3D Semiconductor Packaging Market by Technology, by Material, and Industry Vertical - Global $8.9 Billion Opportunity Analysis and Industry Forecast, 2014-2022 - Research and Markets

Research and Markets has announced the addition of the "3D Semiconductor Packaging Market by Technology, by Material, and Industry Vertical - Global Opportunity Analysis and Industry Forecast, 2014-2022" report to their offering.

Global 3D semiconductor packaging market size is expected to garner $8.9 billion by 2022, growing at a CAGR of 15.7% from 2016 to 2022.

The global 3D semiconductor packaging market is segmented on the basis of technology, materials, industry vertical, and geography. Based on technology, the 3D semiconductor packaging industry is segmented into 3D through silicon via, 3D package on package, 3D fan out based, 3D wire bonded, and others.

By materials, the 3D semiconductor packaging market is classified into organic substrate, bonding wire, leadframe, encapsulation resin, ceramic package, die attach material, and others Furthermore, the 3D semiconductor packaging industry is categorized on the basis of industry vertical, which includes electroncs, industrial, automotive & transport, healthcare, IT & telecommunication, aerospace & defense, and others. Geographically, it is divided into North America, Europe, Asia-Pacific, and LAMEA.

The key players profiled in the report include

• Amkor (News - Alert) Technology
• ASE Group
• Siliconware Precision Industries Co., Ltd.
• Jiangsu Changjiang Electronics Technology Co. Ltd.
• SÜSS MicroTec AG.
• International Business Machines Corporation (IBM)
• Intel Corporation
• Qualcomm Technologies, Inc.
• STMicroelectronics (News - Alert)
• Taiwan Semiconductor Manufacturing Company

MARKET SEGMENTATION

BY TECHNOLOGY

• 3D Through Silicon Via
• 3D Package on Package
• 3D Fan Out Based
• 3D Wire Bonded
• Others (Flip Chip and Hybrid)

BY MATERIAL

• Organic Substrate
• Bonding Wire
• Leadframe
• Encapsulation Resins
• Ceramic Packages
• Die Attach Material
• Others (Underfill Materials and Solder Balls)

BY INDUSTRY VERTICAL

• Electronics
• Industrial
• Automotive & Transport
• Healthcare
• IT & Telecommunication
• Aerospace & Defense
• Others (Media & Entertainment and Renewable Energy Resources)

For more information about this report visit http://www.researchandmarkets.com/research/qqd8pg/3d_semiconductor

View source version on businesswire.com: http://www.businesswire.com/news/home/20170127005327/en/

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