TMCnet News
Hermetic Packaging Market by Configuration, Type, End-User Industry, Geography - Global Forecast to 2022NEW YORK, Dec. 8, 2016 /PRNewswire/ -- "The hermetic packaging market projected to grow at a significant rate" Further, the countries such as China, Japan, and India are now striving to compete with the countries across the globe in aeronautics and space industry. For instance, in August 2016, China launched the first-ever quantum satellite in an effort to develop a communications system that cannot be hacked. Such efforts by the APAC countries to compete with the countries across the globe in space industry are also expected to drive the hermetic packaging market during the forecast period. Breakdown of profile of primary participants: - By Company Type: Tier 1 = 35%, Tier 2 = 45%, and Tier 3 = 20% - By Designation: C-level Executives = 35%, Directors = 25%, and Others = 40% - By Region: North America = 45%, Europe = 20%, APAC = 30%, and RoW = 5% Major players in the hermetic packaging market are Teledyne Microelectronics (U.S.), SCHOTT AG (Germany), AMETEK, Inc. (U.S.), Amkor Technology (U.S.), Texas Instruments Incorporated (U.S.), Micross Components, Inc. (U.S.), Legacy Technologies Inc. (U.S.), KYOCERA Corporation (Japan), Materion Corporation (U.S.), and Willow Technologies (U.K.). Research Coverage: The report on the hermetic packaging market segments the market by configuration, type, application, end-user industry, and geography. Depending on the packaging configurations adopted, the hermetic packaging market based on configuration is segmented into multilayer ceramic packages, metal can packages, and pressed ceramic packages. Depending on the material used for hermetic packaging, the hermetic packaging market based on type is segmented into ceramic–metal sealing (CERTM), glass–metal sealing (GTMS), passivation glass, transponder glass, and reed glass. The hermetic packaging market is segmented on the basis of adoption of hermetic packaging for the electronic components, namely, transistors, sensors, lasers, photodiodes, airbag ignitors, oscillating crystal, MEMS switches, fiber-optic components, and RF connectors, among others. Depending on the adoption of hermetic packaging by various end-user industries, the hermetic packaging market is segmented on the basis of end-user industries, namely, military and defense, aeronautics and space, automotive, energy and nuclear safety, medical, telecommunication, and agriculture and consumer electronics, among others. Lastly, the global hermetic packaging market is segmented into four regions, namely, North America, Europe, APAC, and RoW. The report would help the market leaders/new entrants in this market in the following ways: 1. This report segments the hermetic packaging market comprehensively and provides the closest approximations of the overall market size and that of the subsegments across different end-user industries and regions. 2. The report helps stakeholders to understand the pulse of the market and provides them information on key market drivers, restraints, challenges, and opportunities. 3. This report would help stakeholders to understand their competitors better and gain more insights to enhance their position in the business. The competitive landscape section includes competitor ecosystem, new product launches, partnerships, and acquisitions in the hermetic packaging market. Read the full report: http://www.reportlinker.com/p04442997-summary/view-report.html About Reportlinker ReportLinker is an award-winning market research solution. Reportlinker finds and organizes the latest industry data so you get all the market research you need - instantly, in one place. http://www.reportlinker.com __________________________ Contact Clare: [email protected] US: (339)-368-6001 Intl: +1 339-368-6001 To view the original version on PR Newswire, visit:http://www.prnewswire.com/news-releases/hermetic-packaging-market-by-configuration-type-end-user-industry-geography---global-forecast-to-2022-300375765.html SOURCE Reportlinker |