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TSV Stacked Memory Patent LandscapeLONDON, Nov. 30, 2016 /PRNewswire/ -- A FAST GROWING TSV MEMORY MARKET KNOW THE IP POSITION OF KEY PLAYERS All main applicants in TSV stacked memory technologies are microelectronics giants. Most of them are American or Asian. Interestingly, key patented technologies on TSV stacked memories are hold by American and Asian microelectronics giants (Samsung, SK Hynix, Micron/Elpida, Intel) but also small companies (ELM 3DS, Besang). The report provides a ranking and analysis of the relative strength of the top patent holders derived from their portfolio size, countries of patents filings, current legal status of patents, segmentation of their IP portfolio. The 5 major players (Samsung, Toshiba, Micron/Elpida, SK Hynix, Intel) have been profiled, and for each of them this report provides detailed: patent portfolio analysis with technology and market data, key patents, IP strategies, technical challenges and relevant solutions found in the patents, cross link analysis between marketed products and owned patents for each critical process points. Moreover, the report provides a detailed analysis of the patent litigations ELM 3DS vs SK Hynix/Micron/Samsung. CROSS-LINK ANALYSIS DEVICES/PATENTS The cross-link analysis provides key patents of each critical process points (package, stack, interconnections) matching the teardown of TSV memory devices (HBM, 3DS DDR4, HMC or TSV NAND Memory) of key players. The deep analysis of the patent portfolios held by key players includes a point on relevant technologies for future developments of TSV stacked memories. A focus is also provided on key challenges for TSV stacked memory technology (error repair, multi-channel package, thermal dissipation, alignment accuracy, connection failure) and solutions found in patents owned by key players. IP LITIGATION DEEP ANALYSIS In 2014, with first products appearance (HBM, 3DS DDR4), ELM 3DS filed actions for patent infringement against defendants SK Hynix, Micron Technology and Samsung Electronics. This report provides a complete and deep understanding of IP litigation history including litigated patents families and inter-partes reviews. The analysis includes also status of the cases and prior art analysis before ELM's patents priority date. USEFUL PATENT DATABASE Our report also includes an Excel database containing all of the analyzed patents (1,500+ patents). This database allows multi-criteria searches and includes patent publication number, hyperlinks to the original documents, priority date, title, abstract, patent assignees and legal status for each member of the patent family. ASSIGNEES CITED IN THE REPORT (NON-EXHAUSTIVE) Samsung Electronics, Micron Technology, Elpida Memory, Intel, SK Hynix, Toshiba, AMD, Hitachi, NEC, Hewlett Packard, IBM, Rambus, ELM 3DS, TSMC, SanDisk … KEY FEATURES OF THE REPORT - IP trends including time evolution of patent publications and patent filings countries - Current legal status of patents (granted, pending application, abandoned, expired) - Main patent assignees (ranking, time evolution, geographical coverage) - Joint developments and IP collaboration network of main patent assignees - Key patents - Profile of 5 key players (Samsung, Toshiba, Micron Technology, SK Hynix, Intel), including: o Technology and market data for TSV stacked memory o Key patents o Cross link analysis between teardown analysis, process flow and owned patents for each critical process points o Technical challenges and relevant solutions found in the patents: error repair, multi-channel package, thermal dissipation, alignment accuracy, connection failure o Patent litigations (ELM 3DS vs SK Hynix/Micron/Samsung) - Excel database with all patents analyzed for the 5 key players, including technology segmentation Download the full report: https://www.reportbuyer.com/product/4313695/ About Reportbuyer Reportbuyer is a leading industry intelligence solution that provides all market research reports from top publishers http://www.reportbuyer.com For more information: Sarah Smith Research Advisor at Reportbuyer.com Email: [email protected] Tel: +44 208 816 85 48 Website: www.reportbuyer.com To view the original version on PR Newswire, visit:http://www.prnewswire.com/news-releases/tsv-stacked-memory-patent-landscape-300371060.html SOURCE ReportBuyer |