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Atomic Layer Deposition Equipment Market - Global Industry Analysis Size Share Growth Trends and Forecast 2016 - 2024LONDON, Sept. 8, 2016 /PRNewswire/ -- Globally, electronic device components are being pushed towards micro spatially demanding structures. With the gradual movement towards the limit of Moore's Law, several research and development (R&D) programs are ongoing in pushing the limit of Moore's law. Thin film deposition techniques aid the semiconductor industry in performing the same. It is a process of creating a thin layer on top of a substrate or on top of another 'thin film'. The thickness of the films can range between nanometers to micrometers. Thin film deposition is currently in very high demand and enormous amount of R&D is also ongoing to develop the process further. It is currently being used for various different applications, such as printed electronics, energy generation, optical coatings and energy storage among others. Thin film deposition process can be broadly divided in to Chemical Vapor Deposition (CVD) and Physical Vapor Deposition (PVD). Atomic Layer Deposition (ALD) is considered to be a type of CVD. Both CVD and PVD have various different techniques, advantages and disadvantages. Additionally, continuing technological advancements, has led to the possibility of deposition of different materials on required substrates. The competitive profiling of the key players in the global ALD equipmentmarket across major geographic regions is included in the study. These include diverse business strategies adopted by the leading players and their recent developments as in the field of ALD equipment. A comprehensive analysis of the market dynamics that is inclusive of market drivers, restraints and opportunities is included in the purview of the report. Market dynamics are the distinctive factors which impact the market growth, thereby helping to understand the ongoing trends of the global market. The report provides the forecast of the global market for the period from 2016 to 2024, along with offering an inclusive study of the ALD equipment market. Technology innovation and development is one of the key strategies adopted by most leading players. New product innovation is required to deal with the existing competition in the market. Some major players in the atomic layer deposition equipment market in Asia Pacific, North America, Europe, Latin America, Middle East and Africa include ASM International N.V. (The Netherlands), Aixtron SE (Germany), Entegris, Inc.(The U.S.), Picosun Oy (Finland), CVD Equipment Corporation (The U.S.), Arradiance, Inc.(The U.S.), ALD Nanosolutions, Inc. (The U.S.), Beneq Oy (Finland), Veeco Instruments, Inc. (The U.S.), Applied Materials, Inc. (The U.S.), Oxford Instruments Plc (U.K.), SENTECH Instruments GmbH (Germany),Encapsulix (France), Kurt J. Lesker Company (The U.S.), Ultratech Inc. (The U.S) among others. The Global atomic layer deposition equipment market has been segmented as follows: Global Atomic Layer Deposition Equipment Market by Type Aluminum Oxide (Al2O3) ALD Catalytic ALD Metal ALD ALD on Polymers Others Global Atomic Layer Deposition Equipment Market by Application Semiconductor & Electronics Barrier Layers Integrated Circuit (IC) Applications Solar Panels Display Panels Sensors Others Research & Development Facilities Global Atomic Layer Deposition Equipment Market by Region North America U.S. Canada Rest of North America Europe U.K Germany France Italy Rest of Europe Asia Pacific India China Japan Taiwan South Korea Rest of Asia Pacific Latin America Middle East and Africa Download the full report: https://www.reportbuyer.com/product/4130329/ To view the original version on PR Newswire, visit:http://www.prnewswire.com/news-releases/atomic-layer-deposition-equipment-market---global-industry-analysis-size-share-growth-trends-and-forecast-2016---2024-300325313.html SOURCE ReportBuyer 
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