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Semiconductor Metallization and Interconnects: Technologies and Global MarketsLONDON, June 27, 2016 /PRNewswire/ -- This BCC Research report measures and analyzes the global market for semiconductor metallization. It includes factors currently driving and restraining growth in this market, as well as those with an impact on the future of the industry. Forecast included through 2020. To analyze various processes used in semiconductor metallization and determine the dynamics of each of these processes. To analyze the various interconnecting materials used in semiconductor metallization processes and determine various factors driving and restraining the demand of each of these interconnecting materials. To analyze the various components used for semiconductor metallization and determine their future growth potential. To identify segments with high growth potential and understand future application sectors within these segments. To examine key trends and regional factors related to technology, process, interconnecting material, components and applications that shape and influence the overall market for semiconductor metallization. To examine region-specific developments in the market. To understand the major stakeholders in the market and the competitive landscape for market leaders. To analyze growth strategies of key players in the semiconductor metallization market. To analyze patent data where relevant REASONS FOR CONDUCTING THE STUDY Semiconductor metallization is an integral part of the semiconductor manufacturing process. Increasing demand for tablets, smart phones and smart wearable devices among others is one of the major factors fueling the demand globally for semiconductor metallization. Metallization is the final step in the wafer processing sequence. Metallization is the process by which the components of IC's are interconnected by aluminum conductor. This process produces a thin-film metal layer that will serve as the required conductor pattern for the interconnection of the various components on the chip. Another use of metallization is to produce metallized areas called bonding pads around the periphery of the chip to produce metallized areas for the bonding of wire leads from the package to the chip. The bonding wires are typically 25 micrometer-diameter gold wires, and the bonding pads are usually made to be around 100×100 micrometers square to accommodate fully the flattened ends of the bonding wires and to allow for some registration errors in the placement of the wires on the pads. Download the full report: https://www.reportbuyer.com/product/3922376/ About Reportbuyer Reportbuyer is a leading industry intelligence solution that provides all market research reports from top publishers http://www.reportbuyer.com For more information: Sarah Smith Research Advisor at Reportbuyer.com Email: [email protected] Tel: +44 208 816 85 48 Website: www.reportbuyer.com To view the original version on PR Newswire, visit:http://www.prnewswire.com/news-releases/semiconductor-metallization-and-interconnects-technologies-and-global-markets-300290734.html SOURCE ReportBuyer |