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Research and Markets -Technology and Cost Comparison of InvenSense's ICM-30630 - 6-axis Device (3-axis gyroscope + 3-axis accelerometer)DUBLIN, May 19, 2016 /PRNewswire/ -- Research and Markets has announced the addition of the "InvenSense ICM-30630: Technology and Cost Comparison" report to their offering. (Logo: http://photos.prnewswire.com/prnh/20160330/349511LOGO ) With the emergence of connected objects and wearable devices like the personal fitness coach, InvenSense offers in the ICM-30630 a competitive, complete motion-tracking solution. This report also features a detailed technology and cost comparison with the leading-edge sensor hub from Bosch Sensortec, highlighting the different choices made by the two designers, and InvenSense's incredibly smart design. Key Topics Covered: Overview / Introduction InvenSense Company Profile Physical analysis - Package -- Package characteristics: view, dimensions, and opening -- Package cross-section - MEMS Die -- View, dimensions, and markings -- MEMS sensing area: technical description -- MEMS cap removed -- ASIC delayering and process -- Die cross-section: ASIC -- Die cross-section: MEMS cap and sensor - MCU Die -- View, dimensions, and markings -- Delayering and main block ID -- Process and die cross-section -- Die process characteristics Manufacturing Process Flow - Global overview - ASIC & MCU front-end process - MEMS process flow - ASIC & MCU wafer fabrication unit - Packaging process flow and assembly unit Cost Analysis - Main steps of economic analysis - Yields hypotheses - ASIC front-end cost - MEMS front-end cost - ASIC/MEMS assembly cost - MEMS front-end cost per process steps - Total front-end cost - Back-end 0: probe test and dicing - Wafer and die cost - MCU front-end and back-end 0 cost - MCU die cost - Back-end: packaging cost - Back-end: packaging cost per process steps - Back-end: final test cost - Component cost and price Cost & price comparison with Bosch Sensortec 9-Axis Sensor Hub BMF055 Companies Mentioned - Bosch Sensortec - InvenSense - STMicroelectronics For more information visit http://www.researchandmarkets.com/research/fd666w/invensense Media Contact: |