[May 18, 2016]

InvenSense's ICM-30630 6-axis Device (3-axis gyroscope + 3-axis accelerometer) Technology and Cost Comparison - Research and Markets

Research and Markets has announced the addition of the "InvenSense ICM-30630: Technology and Cost Comparison" report to their offering.

With the emergence of connected objects and wearable devices like the personal fitness coach, InvenSense offers in the ICM-30630 a competitive, complete motion-tracking solution.

The ICM-30630 is the latest version of InvenSense's 6-axis device (3-axis gyroscope + 3-axis accelerometer), based on the same technology used in smartphones like the Apple iPhone (News - Alert), with a MCU included in the package. Compared with the stand-alone sensor hub, this approach eliminates a package and reduces system-level power.

In competition with Bosch Sensortec and STMicroelectronics (News - Alert), InvenSense provides a low-power, highly programmable device for consumer electronics.

ICM-30360 MEMS sensors are fabricated with a low number of masks and are directly assembled on the ASIC by eutectic bonding. The device is shipped in a 3x3x1mm LGA package whose footprint is the same as the previous generation IMU.

Using knowledge obtained from previous acquisitions, InvenSense was able to design its own MCU, which provides a fully open platform.

This report also features a detaild technology and cost comparison with the leading-edge sensor hub from Bosch Sensortec, highlighting the different choices made by the two designers, and InvenSense's incredibly smart design.

Key Topics Covered:

Overview / Introduction

InvenSense Company Profile

Physical analysis

- Package

-- Package characteristics: view, dimensions, and opening

-- Package cross-section

- MEMS Die

-- View, dimensions, and markings

-- MEMS sensing area: technical description

-- MEMS cap removed

-- ASIC delayering and process

-- Die cross-section: ASIC

-- Die cross-section: MEMS cap and sensor

- MCU Die

-- View, dimensions, and markings

-- Delayering and main block ID

-- Process and die cross-section

-- Die process characteristics

Manufacturing Process Flow

- Global overview

- ASIC & MCU front-end process

- MEMS process flow

- ASIC & MCU wafer fabrication unit

- Packaging process flow and assembly unit

Cost Analysis

- Main steps of economic analysis

- Yields hypotheses

- ASIC front-end cost

- MEMS front-end cost

- ASIC/MEMS assembly cost

- MEMS front-end cost per process steps

- Total front-end cost

- Back-end 0: probe test and dicing

- Wafer and die cost

- MCU front-end and back-end 0 cost

- MCU die cost

- Back-end: packaging cost

- Back-end: packaging cost per process steps

- Back-end: final test cost

- Component cost and price

Cost & price comparison with Bosch Sensortec 9-Axis (News - Alert) Sensor Hub BMF055

Companies Mentioned

- Bosch Sensortec

- InvenSense

- STMicroelectronics

For more information visit http://www.researchandmarkets.com/research/w86slx/invensense

View source version on businesswire.com: http://www.businesswire.com/news/home/20160518005719/en/

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